I-Microelectronics & Semiconductor Manufacturing and Fabrication

Amasu ethu amaningi nama-nanomanufacturing, micromanufacturing kanye ne-mesomanufacturing kanye nezinqubo ezichazwe ngaphansi kwamanye amamenyu zingasetshenziselwa MICROELECTRONICS MANUFACTURING_cc781903-5153cde-bbc3b5-58-5cde-bbc-3195-53cde. Kodwa-ke ngenxa yokubaluleka kwe-microelectronics emikhiqizweni yethu, sizogxila esihlokweni esisetshenziswayo salezi zinqubo lapha. Izinqubo ezihlobene nama-Microelectronics nazo zibizwa kabanzi ngokuthi SEMICONDUCTOR FABRICATION processes. Idizayini yethu yobunjiniyela be-semiconductor kanye nezinsizakalo zokwenziwa zifaka:

 

 

 

- FPGA ukwakhiwa kwebhodi, ukuthuthukiswa nokuhlela

 

- Microelectronics Foundry amasevisi: Idizayini, prototyping nokukhiqiza, izinsizakalo zezinkampani zangaphandle

 

- Semiconductor isilutshwana sokulungiselela: Ukudayela, ukubuyisela emuva, ukunciphisa, ukubekwa kwe-reticle, ukuhlela ukufa, ukukhetha nokubeka, ukuhlola

 

- Microelectronic ukwakhiwa kwephakheji nokwenziwa: Kokubili ngaphandle kweshalofu nomklamo wangokwezifiso nokwenza

 

- Semiconductor IC umhlangano & ukupakishwa & ukuhlolwa: Die, ngocingo kanye chip bonding, encapsulation, inhlangano, ukumaka kanye uphawu

 

- Ozimele abaholayo bamadivayisi we-semiconductor: Kokubili ukwakheka okungaphandle kweshalofu kanye nokwakheka ngokwezifiso nokwenza

 

- Ukuklama nokwakhiwa kwamasinki okushisa ama-microelectronics: Kokubili ukwakheka okungaphandle kweshalofu kanye nokwakheka ngokwezifiso nokwenza.

 

- Sensor & i-actuator idizayini nokwenziwa: Kokubili ukwakheka okungaphandle kweshalofu kanye nokwakheka ngokwezifiso nokwenza

 

- Optoelectronic & photonic circuits umklamo nokwenza

 

 

 

Ake sihlole ukwakhiwa kwe-microelectronics kanye ne-semiconductor kanye nobuchwepheshe bokuhlola kabanzi ukuze uqonde kangcono amasevisi nemikhiqizo esiyinikezayo.

 

 

 

I-FPGA Board Design & Development and Programming: Ama-array amasango ahlelekayo (ama-FPGA) angama-silicon chips ahleleleka kabusha. Ngokuphambene namaphrosesa owathola kumakhompuyutha omuntu siqu, ukuhlela i-FPGA kuvuselela i-chip ngokwayo ukuze iqalise ukusebenza komsebenzisi kunokusebenzisa uhlelo lwesofthiwe. Kusetshenziswa amabhulokhi anengqondo akhiwe ngaphambili kanye nezinsiza zomzila ezihlelekayo, ama-chips e-FPGA angacushwa ukuze aqalise ukusebenza kwezingxenyekazi zekhompuyutha zangokwezifiso ngaphandle kokusebenzisa ibhodi lezinkwa nensimbi yokunamathisela. Imisebenzi yekhompyutha yedijithali yenziwa kusofthiwe futhi ihlanganiswe phansi kufayela lokumisa noma i-bitstream equkethe ulwazi lokuthi izingxenye kufanele zixhunywe kanjani ndawonye. Ama-FPGA angasetshenziswa ukwenza noma yimuphi umsebenzi onengqondo i-ASIC engayenza futhi ilungiseka kabusha ngokuphelele futhi inganikezwa “ubuntu” obuhluke ngokuphelele ngokubuyisela ukucushwa kwesekethe okuhlukile. Ama-FPGA ahlanganisa izingxenye ezinhle kakhulu zamasekethe ahlanganisiwe aqondene nohlelo lokusebenza (ama-ASIC) kanye nezinhlelo ezisuselwe kumaphrosesa. Lezi zinzuzo zihlanganisa okulandelayo:

 

 

 

• Izikhathi zokuphendula ezisheshayo ze-I/O kanye nokusebenza okukhethekile

 

• Ukweqa amandla ekhompuyutha wama-digital signal processors (DSPs)

 

• Ukwenza i-prototyping ngokushesha nokuqinisekisa ngaphandle kwenqubo yokwenziwa kwe-ASIC yangokwezifiso

 

• Ukuqaliswa kokusebenza ngokwezifiso ngokuthembeka kwehadiwe enqunyiwe ezinikele

 

• Okungathuthukiswa endaweni okuqeda izindleko zokuklama kabusha nokugcinwa kwe-ASIC ngokwezifiso

 

 

 

Ama-FPGA ahlinzeka ngesivinini nokuthembeka, ngaphandle kokudinga amanani aphezulu ukuze athethelele izindleko ezinkulu zangaphambili zomklamo we-ASIC wangokwezifiso. I-silicon ehlelwa kabusha iphinde ibe nokuguquguquka okufanayo kwesofthiwe esebenza kumasistimu asekelwe ku-processor, futhi ayinqunyelwe ngenani lama-cores okucubungula atholakalayo. Ngokungafani namaphrosesa, ama-FPGA ayahambisana ngempela ngokwemvelo, ngakho-ke ukucubungula okuhlukile akumele kuqhudelane ngezinsiza ezifanayo. Umsebenzi ngamunye wokucutshungulwa ozimele unikezwa ingxenye ezinikele ye-chip, futhi ingasebenza ngokuzenzakalelayo ngaphandle kwethonya elivela kwamanye amabhulokhi anengqondo. Njengomphumela, ukusebenza kwengxenye eyodwa yohlelo lokusebenza akuthikameki lapho ukucubungula okwengeziwe kwengezwa. Amanye ama-FPGA anezici ze-analog ngaphezu kwemisebenzi yedijithali. Ezinye izici ezivamile ze-analog izinga lokubulala elihlelekayo kanye namandla okushayela kuphinikhodi ngayinye yokukhiphayo, okuvumela unjiniyela ukuthi asethe amanani ahamba kancane kumaphini alayishwe kancane abengase akhale noma amangale ngendlela engamukeleki, futhi asethe amanani aqinile, asheshayo kumaphini alayishwe kakhulu ngesivinini esikhulu. iziteshi ebezizohamba kancane kakhulu. Esinye isici esivamile se-analog iziqhathanisi ezihlukanisayo kumaphinikhodi okufaka aklanyelwe ukuxhunywa eziteshini zokubonisa umehluko. Amanye ama-FPGA wesignali axubile ahlanganise iziguquli ze-analog-to-digital (ADCs) kanye neziguquli zedijithali-kuya-analogi (ama-DAC) anamabhulokhi wokulungisa isignali ye-analogi ezivumela ukuthi zisebenze njengesistimu-on-a-chip.

 

 

 

Kafushane, izinzuzo eziphezulu ezi-5 zama-FPGA chips yilezi:

 

1. Ukusebenza Okuhle

 

2. Isikhathi Esifushane Sokuya Emakethe

 

3. Izindleko Eziphansi

 

4. Ukwethembeka okuphezulu

 

5. Amandla Okugcina Isikhathi Eside

 

 

 

Ukusebenza Okuhle - Ngamandla awo okwamukela ukucubungula okufanayo, ama-FPGA anamandla ekhompuyutha angcono kunama-Digital signal processors (DSPs) futhi awadingi ukubulawa okulandelanayo njengama-DSP futhi angafeza okwengeziwe ngomjikelezo wewashi ngalinye. Ukulawula okokufaka nokuphumayo (I/O) kuleveli yezingxenyekazi zekhompuyutha kunikeza izikhathi zokuphendula ezisheshayo kanye nokusebenza okukhethekile ukuze kufane eduze nezidingo zohlelo lokusebenza.

 

 

 

Isikhathi esifushane sokumaketha - ama-FPGA anikeza ukuguquguquka kanye nekhono lokukhiqiza ngokushesha futhi ngaleyo ndlela abe nesikhathi esifushane sokuya emakethe. Amakhasimende ethu angahlola umbono noma umqondo futhi awuqinisekise ku-hardware ngaphandle kokudlula kunqubo ende nebizayo yokwenziwa yomklamo wangokwezifiso we-ASIC. Singasebenzisa izinguquko ezikhulayo futhi siphindaphinde kumklamo we-FPGA phakathi namahora esikhundleni samaviki. Izingxenyekazi zekhompuyutha ezingaphandle kweshalofu zezentengiselwano nazo ziyatholakala ngezinhlobo ezahlukene ze-I/O esezivele zixhunywe ku-chip ye-FPGA ehlelwa umsebenzisi. Ukutholakala okukhulayo kwamathuluzi esoftware yezinga eliphezulu kunikeza ama-IP cores abalulekile (imisebenzi eyakhiwe kusengaphambili) yokulawula okuthuthukile nokucubungula isignali.

 

 

 

Izindleko Eziphansi—Izindleko zobunjiniyela ezingabuyeli (NRE) zemiklamo ye-ASIC yangokwezifiso zidlula ezezixazululo zehadiwe ezisekelwe ku-FPGA. Ukutshalwa kwezimali okukhulu kokuqala kuma-ASIC kungathethelelwa ukuthi ama-OEM akhiqize ama-chips amaningi ngonyaka, kodwa abasebenzisi abaningi bokugcina badinga ukusebenza kwehadiwe yangokwezifiso kumasistimu amaningi asathuthuka. I-silicon FPGA yethu ehlelekayo ikunikeza okuthile ngaphandle kwezindleko zokwenziwa noma izikhathi zokuhola ezinde zokuhlanganisa. Izidingo zesistimu zivame ukushintsha ngokuhamba kwesikhathi, futhi izindleko zokwenza izinguquko ezikhulayo kumiklamo ye-FPGA azinakwa uma ziqhathaniswa nezindleko ezinkulu zokuphinda usebenzise i-ASIC.

 

 

 

Ukuthembeka Okuphezulu - Amathuluzi esofthiwe ahlinzeka ngendawo yokuhlela futhi ukujikeleza kwe-FPGA kuwukuqaliswa kweqiniso kokwenziwa kohlelo. Amasistimu asekelwe kumaphrosesa ngokuvamile abandakanya izendlalelo eziningi zokungafinyeleli ukusiza ukuhlela umsebenzi nokwabelana ngezinsiza phakathi kwezinqubo eziningi. Isendlalelo somshayeli silawula izinsiza zehadiwe futhi i-OS ilawula inkumbulo kanye nomkhawulokudonsa wephrosesa. Kunoma yimuphi umgogodla wephrosesa onikeziwe, umyalelo owodwa kuphela ongawusebenzisa ngesikhathi, futhi amasistimu asuselwa kuphrosesa ahlala esengozini yemisebenzi ebaluleke kakhulu yesikhathi elandelanayo. Ama-FPGA, awasebenzisi ama-OS, abeka ukukhathazeka kokuthembeka okuncane ngokusebenza kwawo kwangempela okuhambisanayo kanye nezingxenyekazi zekhompuyutha ezinqumayo ezinikezelwe kuwo wonke umsebenzi.

 

 

 

Amandla Okugcina Isikhathi Eside - Ama-chips e-FPGA ayathuthukiswa futhi awadingi isikhathi nezindleko ezihilelekile ekuklameni kabusha i-ASIC. Izimiso zokuxhumana zedijithali, isibonelo, zinezincazelo ezingashintsha ngokuhamba kwesikhathi, futhi ukuxhumana okusekelwe ku-ASIC kungase kubangele izinselele zokulondoloza nokuhambisana phambili. Ngokuphambene, ama-FPGA chips angalungiseka kabusha angahambisana nezinguquko ezingase zidingekile zesikhathi esizayo. Njengoba imikhiqizo nezinhlelo zivuthwa, amakhasimende ethu angenza izithuthukisi zokusebenza ngaphandle kokuchitha isikhathi edizayina kabusha izingxenyekazi zekhompuyutha futhi elungisa izakhiwo zebhodi.

 

 

 

Izinsizakalo Zokutholwa Kwe-Microelectronics: Izinsizakalo zethu zokusungula i-microelectronics zifaka ukuklama, ukwenza i-prototyping kanye nokukhiqiza, izinsizakalo zezinkampani zangaphandle. Sihlinzeka amakhasimende ethu ngosizo kuwo wonke umjikelezo wokuthuthukiswa komkhiqizo - kusukela ekusekelweni kwedizayini kuye ekwenzeni i-prototyping kanye nokwesekwa kokukhiqiza kwama-semiconductor chips. Inhloso yethu ezinsizeni zosekelo zedizayini ukunika amandla indlela elungile yokuqala ngqa yedizayini yedijithali, ye-analog, kanye nengxubevange yesiginali yamadivayisi we-semiconductor. Isibonelo, amathuluzi okulingisa athile we-MEMS ayatholakala. Izindwangu ezikwazi ukuphatha amawafa angu-6 namayintshi angu-8 we-CMOS ehlanganisiwe ne-MEMS asenkonzweni yakho. Sinikeza amakhasimende ethu ukwesekwa kwedizayini yazo zonke izinkundla ezinkulu ze-electronic design automation (EDA), sihlinzeka ngamamodeli alungile, amakhithi okuklama amaprosesa (i-PDK), imitapo yolwazi ye-analog neyedijithali, nokusekelwa kwedizayini yokukhiqiza (DFM). Sinikeza izinketho ezimbili ze-prototyping zabo bonke ubuchwepheshe: isevisi ye-Multi Product Wafer (MPW), lapho amadivaysi amaningana acutshungulwa ngokuhambisana ku-wafer eyodwa, kanye nesevisi ye-Multi Level Mask (MLM) enamaleveli amamaski amane adwetshwe ku-reticle efanayo. Lezi zonga kakhulu kunesethi yemaski egcwele. Isevisi ye-MLM iguquguquka kakhulu uma iqhathaniswa nezinsuku ezimisiwe zesevisi ye-MPW. Izinkampani zingase zikhethe ukukhipha imikhiqizo ye-semiconductor endaweni yokutholwa kwama-microelectronics ngenxa yezizathu eziningi ezihlanganisa isidingo somthombo wesibili, zisebenzisa izinsiza zangaphakathi zeminye imikhiqizo namasevisi, ukuzimisela ukuhamba ngendlela engelona iqiniso futhi yehlise ubungozi kanye nomthwalo wokusebenzisa indwangu ye-semiconductor...njll. I-AGS-TECH inikeza izinqubo zokwenziwa kwe-open-platform microelectronics ezingancishiswa kuma-wafer run amancane kanye nokukhiqizwa ngobuningi. Ngaphansi kwezimo ezithile, amathuluzi akho akhona e-microelectronics noma okwenziwa kwe-MEMS noma amasethi amathuluzi aphelele angadluliselwa njengamathuluzi athunyelwe noma athengiswe amathuluzi asuka kundwangu yakho aye kusayithi lethu lendwangu, noma imikhiqizo yakho ekhona ye-microelectronics kanye ne-MEMS ingaklanywa kabusha kusetshenziswa ubuchwepheshe benkundla evulekile futhi ithunyelwe ku- inqubo etholakala ku-fab yethu. Lokhu kuyashesha futhi konga kakhulu kunokudlulisa ubuchwepheshe bangokwezifiso. Uma uthanda kodwa izinqubo zokwenziwa zekhasimende ezikhona ze-microelectronics / MEMS zingadluliswa.

 

 

 

Ukulungiselela I-Semiconductor Wafer: Uma efunwa amakhasimende ngemva kokuba ama-wafer enziwe ngendwangu encane, senza ukudayela, ukubuyisela emuva, ukuphungula, ukubeka i-reticle, ukuhlela amafa, ukukhetha nokubeka, imisebenzi yokuhlola ku-semiconductor. Ukucutshungulwa kwe-wafer ye-semiconductor kubandakanya i-metrology phakathi kwezinyathelo zokucubungula ezahlukahlukene. Isibonelo, izindlela zokuhlola ifilimu emincane esekelwe ku-ellipsometry noma i-reflectometry, zisetshenziselwa ukulawula ngokuqinile ukushuba kwesango le-oxide, kanye nogqinsi, inkomba ye-refractive kanye ne-coefficient yokuqothula ye-photoresist nezinye izigqoko. Sisebenzisa okokusebenza kokuhlola kwe-wafer ye-semiconductor ukuze siqinisekise ukuthi ama-wafer awalimalanga izinyathelo zangaphambilini zokucubungula kuze kufike ekuhlolweni. Uma izinqubo zangaphambili seziqediwe, amadivaysi e-semiconductor microelectronic angaphansi kokuhlolwa okuhlukahlukene kagesi ukuze kutholwe ukuthi asebenza kahle yini. Sibhekisela engxenyeni yamadivayisi e-microelectronics ku-wafer etholwe isebenza kahle ngokuthi "isivuno". Ukuhlolwa kwama-microelectronics chips ku-wafer kwenziwa ngesihloli se-electronic esicindezela ama-probe amancane ngokumelene ne-semiconductor chip. Umshini ozishintshayo umaka i-microelectronics chip ngayinye embi ngethonsi likadayi. Idatha yokuhlola i-wafer ifakwe kusizindalwazi sekhompuyutha emaphakathi futhi ama-semiconductor chips ahlelwa abe imigqomo ebonakalayo ngokuya ngemikhawulo yokuhlola enqunywe kusengaphambili. Idatha ewumphumela yokubopha ingafakwa kugrafu, noma ifakwe kumephu ye-wafer ukuze kulandelelwe amaphutha okukhiqiza nokumaka ama-chips amabi. Le mephu ingasetshenziswa futhi ngesikhathi sokuhlanganiswa kwe-wafer kanye nokupakishwa. Ekuhlolweni kokugcina, ama-microelectronic chips ayahlolwa futhi ngemva kokupakishwa, ngenxa yokuthi izintambo zebhondi kungenzeka zishoda, noma ukusebenza kwe-analog kungase kushintshwe iphakheji. Ngemuva kokuthi iwafa ye-semiconductor isihloliwe, ivamise ukuncishiswa ngogqinsi ngaphambi kokuthi iwafa ifakwe amaphuzu bese igqekezwa ishone ngayinye. Le nqubo ibizwa ngokuthi i-semiconductor wafer dicing. Sisebenzisa imishini yokukhetha nendawo ezenzakalelayo ekhiqizwe ngokukhethekile imboni ye-microelectronics ukuze silungise ukufa kwe-semiconductor okuhle nokubi. Ama-chips we-semiconductor amahle kuphela, ahlanganisiwe. Okulandelayo, kupulasitiki ye-microelectronics noma inqubo yokupakisha ye-ceramic sikhweza i-semiconductor die, sixhume amaphedi okufa kumaphini ephaketheni, bese sivala idayizi. Izintambo zegolide ezincane zisetshenziselwa ukuxhuma amaphedi nezikhonkwane kusetshenziswa imishini ezenzakalelayo. I-Chip scale package (CSP) ingobunye ubuchwepheshe bokupakisha be-microelectronics. Iphakethe lepulasitiki elikabili emgqeni (i-DIP), njengamaphakheji amaningi, likhulu ngokuphindwe kaningi kunefa le-semiconductor langempela elifakwe ngaphakathi, kanti ama-CSP chips acishe alingane nama-microelectronics afayo; futhi i-CSP ingakhiwa endaweni ngayinye ngaphambi kokuthi iwafa ye-semiconductor idayiwe. Ama-microelectronic chips apakishiwe aphinde ahlolwe ukuze kuqinisekiswe ukuthi awonakele ngesikhathi sokupakishwa nokuthi inqubo yokuxhumanisa i-die-to-pin iqedwe ngendlela efanele. Sisebenzisa ama-lasers siqopha amagama nezinombolo ze-chip ephaketheni.

 

 

 

I-Microelectronic Package Design and Fabrication: Sinikeza kokubili i-off-shelf kanye nomklamo wangokwezifiso kanye nokwakhiwa kwamaphakheji we-microelectronic. Njengengxenye yale sevisi, ukumodela kanye nokulingiswa kwamaphakheji we-microelectronic nakho kwenziwa. Ukumodela nokulingisa kuqinisekisa i-virtual Design of Experiments (DoE) ukuze kuzuzwe isisombululo esifanele, kunokuhlola amaphakheji enkundleni. Lokhu kunciphisa izindleko nesikhathi sokukhiqiza, ikakhulukazi ukuthuthukiswa komkhiqizo omusha kuma-microelectronics. Lo msebenzi futhi usinika ithuba lokuchaza amakhasimende ethu ukuthi ukuhlanganisa, ukwethembeka nokuhlola kuzoba nomthelela kanjani emikhiqizweni yawo ye-microelectronic. Inhloso eyinhloko yokupakishwa kwe-microelectronic iwukuklama isistimu ye-elekthronikhi ezokwanelisa izimfuneko zohlelo oluthile ngezindleko ezifanele. Ngenxa yezinketho eziningi ezitholakalayo zokuxhuma nokufaka isistimu ye-microelectronics, ukukhetha kobuchwepheshe bokupakisha kuhlelo olunikeziwe kudinga ukuhlolwa kochwepheshe. Imibandela yokukhetha yamaphakeji e-microelectronics ingase ihlanganise okunye kokushayela kobuchwepheshe okulandelayo:

 

-Ukusebenziseka kalula

 

-Veza

 

-Izindleko

 

-Izakhiwo zokukhipha ukushisa

 

-Ukusebenza kwe-electromagnetic shielding

 

-Ukuqina komshini

 

-Ukwethembeka

 

Lokhu kucatshangelwa kwedizayini yamaphakheji we-microelectronics kuthinta isivinini, ukusebenza, amazinga okushisa okuhlangana, ivolumu, isisindo nokunye. Umgomo oyinhloko ukukhetha ubuchwepheshe bokuxhumanisa obungabizi kakhulu kodwa obuthembekile. Sisebenzisa izindlela zokuhlaziya eziyinkimbinkimbi nesofthiwe ukuze sidizayine amaphakheji e-microelectronics. Ukupakishwa kwe-Microelectronics kuphathelene nokuklanywa kwezindlela zokwenziwa kwamasistimu amancane kagesi axhumene kanye nokuthembeka kwalawo masistimu. Ngokukhethekile, ukupakishwa kwama-microelectronics kuhlanganisa umzila wamasignali ngenkathi kugcinwa ubuqotho besignali, ukusabalalisa umhlabathi namandla kumasekethe ahlanganisiwe we-semiconductor, ukusabalalisa ukushisa okuhlakaziwe ngenkathi kugcinwa ubuqotho besakhiwo kanye nempahla, nokuvikela isifunda ezingozini zemvelo. Ngokuvamile, izindlela zokupakisha ama-microelectronics IC zifaka ukusetshenziswa kwe-PWB enezixhumi ezihlinzeka ngama-I/O omhlaba wangempela kusekethe kagesi. Izindlela zokupakisha zendabuko ze-microelectronics zibandakanya ukusetshenziswa kwephakheji elilodwa. Inzuzo eyinhloko yephakheji ye-chip eyodwa yikhono lokuhlola ngokugcwele i-microelectronics IC ngaphambi kokuyixhuma ku-substrate engaphansi. Amadivayisi anjalo apakishiwe e-semiconductor afakwe ngembobo noma abekwe phezulu ku-PWB. Amaphakheji e-microelectronics afakwe phezulu awadingi ukuthi adlule ngezimbobo ebhodini lonke. Esikhundleni salokho, izingxenye zama-microelectronics abekwe phezulu zingadayiswa kuzo zombili izinhlangothi ze-PWB, okuvumela ukuminyana kwesekethe okuphezulu. Le ndlela ibizwa ngokuthi i-surface-mount technology (SMT). Ukwengezwa kwamaphakheji esitayela sendawo efana ne-ball-grid arrays (BGAs) kanye namaphakheji esikali se-chip (CSPs) kwenza i-SMT iqhudelane nobuchwepheshe bokupakisha be-semiconductor microelectronics obuphezulu kakhulu. Ubuchwepheshe obusha bokupakisha bubandakanya ukunamathiselwa kwedivayisi ye-semiconductor engaphezu kweyodwa ku-substrate exhumanisayo ephezulu, ebese ifakwa kuphakheji enkulu, ehlinzeka kokubili izikhonkwane ze-I/O nokuvikelwa kwemvelo. Lobu buchwepheshe bemojula ye-multichip (MCM) bubonakala futhi ngobuchwepheshe be-substrate obusetshenziswa ukuxhuma ama-IC anamathiselwe. I-MCM-D imele ifilimu elincanyana elifakwe insimbi kanye nama-dielectric multilayers. Ama-substrates e-MCM-D anokuminyana kwezintambo okuphezulu kakhulu kwabo bonke ubuchwepheshe be-MCM ngenxa yobuchwepheshe obuyindida bokucubungula i-semiconductor. I-MCM-C ibhekisela kuma-substrates "oceramic" anezendlalelo eziningi, axoshwe ezendlaleloni ezishintshanayo zoyinki wensimbi abahloliwe kanye namashidi e-ceramic angashiswanga. Ngokusebenzisa i-MCM-C sithola umthamo wezintambo eziminyene ngokumaphakathi. I-MCM-L ibhekisela kuma-substrates ezendlalelo eziningi enziwe “ngamalayini” e-PWB estakiwe, enziwe ngensimbi, anephethini ngayinye bese enziwe laminated. Bekukade kuwubuchwepheshe bokuxhumanisa obunokuminyana okuphansi, nokho manje i-MCM-L isondela ngokushesha ekuminyaneni kobuchwepheshe bokupakisha be-MCM-C kanye ne-MCM-D microelectronics. I-Direct chip attach (DCA) noma ubuchwepheshe bokupakisha be-chip-on-board (COB) microelectronics buhlanganisa ukukhweza ama-microelectronics ICs ngqo ku-PWB. I-encapsulant yepulasitiki, "egubungele" phezu kwe-IC engenalutho bese yelapheka, inikeza ukuvikelwa kwemvelo. I-Microelectronics ICs ingaxhunywa ku-substrate kusetshenziswa i-flip-chip, noma izindlela zokubopha izintambo. Ubuchwepheshe be-DCA bonga kakhulu kumasistimu akhawulelwe kuma-IC we-semiconductor angu-10 noma ngaphansi, njengoba izinombolo ezinkulu zama-chips zingathinta ukukhiqizwa kwesistimu futhi ukuhlanganisa kwe-DCA kungase kube nzima ukuphinda kusebenze. Inzuzo evamile kuzo zombili izinketho zokupakisha ze-DCA ne-MCM ukuqedwa kwezinga lokuxhuma lephakeji ye-IC semiconductor, okuvumela ukusondelana (ukubambezeleka kokudlulisa isignali okufushane) kanye nokuncishiswa kokungena komthofu. Ububi obuyinhloko ngazo zombili izindlela ubunzima bokuthenga ama-IC ahlolwe ngokugcwele ama-microelectronics. Okunye okubi kobuchwepheshe be-DCA kanye ne-MCM-L kufaka phakathi ukuphathwa okushisayo kokushisa okuphansi ngenxa yokungabi khona kokusebenza okushisayo kwama-laminates e-PWB kanye ne-coefficient empofu yomdlalo wokunwebeka oshisayo phakathi kwe-semiconductor die kanye ne-substrate. Ukuxazulula inkinga yokungezwani kokwanda okushisayo kudinga i-interposer substrate efana ne-molybdenum ye-wire bonded die kanye ne-epoxy engagcwali ye-flip-chip die. I-multichip carrier module (MCCM) ihlanganisa zonke izici ezinhle ze-DCA nobuchwepheshe be-MCM. I-MCCM imane iyi-MCM encane esiphathini sensimbi esincanyana esingaboshelwa noma sinamathiselwe ngomshini ku-PWB. Iphansi lensimbi lisebenza njengento ekhipha ukushisa kanye ne-interposer yengcindezi ye-MCM substrate. I-MCCM inomkhondo ojikelezayo wokubopha intambo, ukusoda, noma ukubopha ithebhu ku-PWB. Ama-IC we-semiconductor avikelekile avikelwe kusetshenziswa i-glob-top material. Uma usithinta, sizoxoxa ngesicelo sakho kanye nezidingo zokukukhethela inketho yokupakisha ye-microelectronics engcono kakhulu.

 

 

 

I-Semiconductor IC Assembly & Packaging & Test: Njengengxenye yezinsizakalo zethu zokwenziwa kwe-microelectronics sinikeza i-die, intambo ne-chip bonding, i-encapsulation, ukuhlanganisa, ukumaka nokufaka uphawu, ukuhlola. Ukuze i-chip ye-semiconductor noma isekethe ye-microelectronics ehlanganisiwe isebenze, idinga ukuxhunywa kusistimu ezoyilawula noma inikeze imiyalelo kuyo. I-Microelectronics IC assembly ihlinzeka ngoxhumano lwamandla nolwazi lokudlulisa phakathi kwe-chip nohlelo. Lokhu kufezwa ngokuxhuma i-chip ye-microelectronics kuphakheji noma ukuyixhuma ngokuqondile ku-PCB yale misebenzi. Ukuxhumana phakathi kwe-chip nephakheji noma ibhodi lesekethe eliphrintiwe (PCB) kwenziwa nge-wire bonding, i-thru-hole noma i-flip chip assembly. Singumholi wemboni ekutholeni izixazululo zokupakisha ze-microelectronics IC ukuze sihlangabezane nezidingo eziyinkimbinkimbi zezimakethe ezingenantambo neze-inthanethi. Sinikeza izinkulungwane zamafomethi wephakheji nosayizi abahlukene, kusukela kumaphakheji we-IC we-leadframe microelectronics ye-thru-hole ne-surface mount, kuya ku-chip scale yakamuva (CSP) kanye nezixazululo ze-ball grid array (BGA) ezidingekayo ekubalweni kwamaphinikhodi aphezulu kanye nezinhlelo zokusebenza zokuminyana okuphezulu. . Amaphakheji anhlobonhlobo ayatholakala esitokweni ahlanganisa i-CABGA (Chip Array BGA), CQFP, CTBGA (Chip Array Thin Core BGA), CVBGA (Very Thin Chip Array BGA), Flip Chip, LCC, LGA, MQFP, PBGA, PDIP, I-PLCC, i-PoP - Iphakheji Kuphakheji, i-PoP TMV - Ngesikhunta Via, SOIC / SOJ, SSOP, TQFP, TSOP, WLP (Iphakheji Yezinga Le-Wafer)…..etc. Ukubopha ngocingo kusetshenziswa ithusi, isiliva noma igolide kuphakathi kwezinto ezidumile kuma-microelectronics. Intambo yethusi (Cu) ibiyindlela yokuxhuma i-silicon semiconductor ifa kumatheminali ephakheji ye-microelectronics. Ngokukhuphuka kwakamuva kwezindleko zezintambo zegolide (Au), intambo yethusi (Cu) iyindlela ekhangayo yokuphatha izindleko zephakheji ku-microelectronics. Iphinde ifane nocingo lwegolide (Au) ngenxa yezakhiwo zayo zikagesi ezifanayo. I-self-inductance ne-self capacitance icishe ifane ngentambo yegolide (Au) neyethusi (Cu) enentambo yethusi (Cu) enokumelana okuphansi. Kuzinhlelo zokusebenza ze-microelectronics lapho ukumelana ngenxa yentambo yebhondi kungase kube nomthelela omubi ekusebenzeni kwesekethe, kusetshenziswa intambo yethusi (Cu) inganikeza ukuthuthuka. Izintambo zengxubevange yethusi, iPalladium Coated Copper (PCC) kanye neSilver (Ag) sezivele njengezinye izindlela kunezintambo zegolide zamabhondi ngenxa yezindleko. Izintambo ezenziwe ngethusi azibizi futhi zine-resistivity kagesi ephansi. Kodwa-ke, ukuqina kwethusi kwenza kube nzima ukusebenzisa izinhlelo eziningi ezifana nalezo ezinezakhiwo ezibuthakathaka zebhondi. Kulezi zinhlelo zokusebenza, i-Ag-Alloy inikezela ngezakhiwo ezifanayo nalezo zegolide kuyilapho izindleko zayo zifana nalezo ze-PCC. Intambo ye-Ag-Alloy ithambile kune-PCC okuholela emazingeni aphansi e-Al-Splash kanye nengozi ephansi yokulimala kwephedi yebhondi. I-Ag-Alloy wire iwukushintsha okungcono kakhulu kwezindleko eziphansi zezinhlelo zokusebenza ezidinga i-die-to-die bonding, i-waterfall bonding, i-ultra-fine bond pad pitch kanye nokuvuleka kwephedi yebhondi encane, ukuphakama kwelophu ephansi kakhulu. Sihlinzeka ngohlu oluphelele lwezinsizakalo zokuhlola i-semiconductor okuhlanganisa ukuhlolwa kwe-wafer, izinhlobo ezahlukene zokuhlola kokugcina, ukuhlolwa kwezinga lesistimu, ukuhlolwa kwemichilo kanye nezinsizakalo eziphelele zokuphela komugqa. Sihlola izinhlobo ezahlukene zedivayisi ye-semiconductor kuyo yonke imindeni yethu yamaphakeji okuhlanganisa imvamisa yomsakazo, i-analog nesiginali exubile, idijithali, ukuphathwa kwamandla, inkumbulo nezinhlanganisela ezihlukahlukene ezifana ne-ASIC, amamojula e-multi chip, i-System-in-Package (SiP), kanye ukupakishwa kwe-3D estakiwe, izinzwa namadivayisi we-MEMS afana nama-accelerometer nezinzwa zokucindezela. I-Hardware yethu yokuhlola kanye nemishini yokuxhumana ifanele usayizi wephakheji wangokwezifiso i-SiP, izixazululo zokuxhumana ezikabili zePhakheji kuPhakheji (i-PoP), i-TMV PoP, amasokhethi e-FusionQuad, i-MicroLeadFrame enemigqa eminingi, I-Fine-Pitch Copper Pillar. Imishini yokuhlola nezitezi zokuhlola kuhlanganiswe namathuluzi e-CIM/CAM, ukuhlaziya isivuno nokuqapha ukusebenza ukuze kulethe isivuno esihle kakhulu okokuqala ngqa. Sinikezela ngezinqubo eziningi zokuhlola i-microelectronics kumakhasimende ethu futhi sinikezela ngokugeleza kokuhlola okusabalalisiwe kwe-SiP nokunye ukugeleza komhlangano oyinkimbinkimbi. I-AGS-TECH ihlinzeka ngobubanzi obugcwele bokubonisana, ukuthuthukiswa kanye nezinsizakalo zobunjiniyela kuwo wonke umjikelezo wakho wokuphila womkhiqizo we-semiconductor kanye ne-microelectronics. Siyaziqonda izimakethe ezihlukile kanye nezidingo zokuhlola ze-SiP, izimoto, inethiwekhi, amageyimu, ihluzo, ikhompuyutha, i-RF / wireless. Izinqubo zokukhiqiza ama-semiconductor zidinga izixazululo zokumaka ezisheshayo nezilawulwa ngokunembile. Izivinini zokumaka ezingaphezu kwezinhlamvu eziyi-1000/ngesekhondi kanye nokujula kokungena kokubalulekile okungaphansi kwama-microns angu-25 kuvamile embonini ye-semiconductor microelectronics kusetshenziswa ama-laser athuthukile. Siyakwazi ukumaka izinhlanganisela zesikhunta, amawafa, izitsha zobumba nokunye okuningi ngokufakwa kokushisa okuncane nokuphindaphinda kahle. Sisebenzisa ama-laser ngokunemba okuphezulu ukumaka ngisho nezingxenye ezincane ngaphandle kokulimala.

 

 

 

Amafreyimu aholayo Amadivayisi e-Semiconductor: Kokubili i-off-shelf kanye nedizayini yangokwezifiso nokwenziwa kuyenzeka. Amafreyimu omthofu asetshenziswa ezinqubweni zokuhlanganisa idivayisi ye-semiconductor, futhi empeleni ayizendlalelo ezincane zensimbi ezixhuma izintambo ezisuka kumatheminali amancane kagesi endaweni ye-semiconductor microelectronics kuya kumjikelezo omkhulu kumadivayisi kagesi nama-PCB. Amafreyimu omthofu asetshenziswa cishe kuwo wonke amaphakheji we-semiconductor microelectronics. Amaphakheji amaningi e-IC ye-microelectronics enziwa ngokubeka i-silicon chip ye-semiconductor ohlakeni oluholayo, bese kuba intambo ebopha i-chip emithonjeni yensimbi yalolo hlaka lomthofu, bese imboza chip ye-microelectronics ngekhava yepulasitiki. Le phakheji elula futhi ephansi kakhulu ye-microelectronics iseyisixazululo esingcono kakhulu sezinhlelo zokusebenza eziningi. Amafreyimu omthofu akhiqizwa ngamapheshana amade, okuwavumela ukuthi acutshungulwe ngokushesha emishinini yokuhlanganisa ezenzakalelayo, futhi ngokuvamile kusetshenziswa izinqubo ezimbili zokukhiqiza: ukufakwa kwezithombe kohlobo oluthile nokugxiviza. Ku-microelectronics idizayini yohlaka oluholayo ngokuvamile idinga ukucaciswa nezici ezingokwezifiso, imiklamo ethuthukisa izakhiwo zikagesi nezishisayo, kanye nezidingo zesikhathi somjikelezo othile. Sinolwazi olujulile lokwenziwa kohlaka oluholayo lwe-microelectronics lwamakhasimende amaningi ahlukene asebenzisa ukushumeka izithombe nokugxivizwa nge-laser.

 

 

 

Idizayini nokwenziwa kwamasinki okushisa ama-microelectronics: Kokubili ngaphandle kweshalofu kanye nokwakheka ngokwezifiso nokwenza. Ngokukhula kokukhishwa kokushisa okuvela kumadivayisi e-microelectronics kanye nokuncipha kwezici zefomu jikelele, ukuphathwa kwe-thermal kuba into ebaluleke kakhulu yokwakhiwa komkhiqizo we-elekthronikhi. Ukungaguquguquki ekusebenzeni kanye neminyaka yokuphila kwemishini kagesi kuhlobene ngokuphambene nezinga lokushisa lengxenye yezinto zokusebenza. Ubudlelwano phakathi kokuthembeka nezinga lokushisa lokusebenza kwedivayisi evamile ye-silicon semiconductor libonisa ukuthi ukuncipha kwezinga lokushisa kuhambisana nokwenyuka komchazi kokuthembeka neminyaka yokuphila kwedivayisi. Ngakho-ke, impilo ende nokusebenza okuthembekile kwengxenye ye-semiconductor microelectronics kungase kuzuzwe ngokulawula ngempumelelo izinga lokushisa ledivayisi ngaphakathi kwemikhawulo ebekwe abaklami. Osinki bokushisa bangamadivayisi athuthukisa ukunqanyulwa kokushisa endaweni eshisayo, ngokuvamile ikesi yangaphandle yengxenye ekhiqiza ukushisa, ukuya endaweni epholile efana nomoya. Ezingxoxweni ezilandelayo, umoya uthathwa njengoketshezi olupholisayo. Ezimweni eziningi, ukudluliswa kokushisa kuyo yonke indawo phakathi kwendawo eqinile nomoya opholile kungasebenzi kahle kakhulu ngaphakathi kwesistimu, futhi isixhumi esibonakalayo somoya oqinile simelela umgoqo omkhulu kakhulu wokukhipha ukushisa. Isitha sokushisa sehlisa lesi sivimbelo ngokuyinhloko ngokukhulisa indawo engaphezulu ethintana ngqo nesipholile. Lokhu kuvumela ukushisa okwengeziwe ukuthi kuhlakazwe futhi/noma kwehlise izinga lokushisa lokusebenza kwedivayisi ye-semiconductor. Injongo eyinhloko yosinki wokushisa iwukugcina izinga lokushisa ledivayisi ye-microelectronics lingaphansi kwezinga eliphezulu lokushisa elivumelekile elicaciswe umkhiqizi wedivayisi ye-semiconductor.

 

 

 

Singakwazi ukuhlukanisa amasinki okushisa ngokwezindlela zokukhiqiza kanye nokuma kwawo. Izinhlobo ezivame kakhulu zamasinki okushisa apholile zifaka:

 

 

 

- Izitembu: Izinsimbi ze-Copper noma i-aluminium zigxivizwa zibe yizimo ezifunwayo. zisetshenziswa ekupholiseni komoya kwendabuko kwezingxenye ze-elekthronikhi futhi zinikeza isixazululo esinomnotho ezinkingeni ezishisayo zokuminyana okuphansi. Zifanele ukukhiqizwa kwevolumu ephezulu.

 

 

 

- I-Extrusion: Lawa masinki okushisa avumela ukwakheka komumo obanzi onezinhlangothi ezimbili okwazi ukuqeda imithwalo yokushisa emikhulu. Angase asikwe, enziwe ngomshini, futhi angezwe izinketho. I-cross-cutting izokhiqiza amasinki okushisa e-omnidirectional, amaphinikhodi angama-rectangular, futhi okuhlanganisa amaphiko amisekile kuthuthukisa ukusebenza cishe ngo-10 ukuya ku-20%, kodwa ngesilinganiso esinensayo sokukhipha. Imikhawulo ye-Extrusion, efana nogqinsi lwe-fin height-to-gap fin, ngokuvamile ilawula ukuguquguquka kwezinketho zedizayini. Isici esijwayelekile se-fin height-to-gap esifinyelela ku-6 kanye nobuncane be-fin ukujiya obungu-1.3mm, singafinyeleleka ngamasu ajwayelekile okukhipha. I-aspect ratio engu-10 kuye ku-1 kanye nogqinsi luka-0.8″ lungatholwa ngezici ezikhethekile zedizayini ye-die. Kodwa-ke, njengoba i-aspect ratio ikhula, ukubekezelelana kwe-extrusion kuba sengozini.

 

 

 

- Izinqamuleli Ezihlanganisiwe/Ezakhiwe: Amasinki amaningi okushisa apholile anomkhawulo wokuguquguquka, futhi ukusebenza okushisayo kukonke kwesinki wokushisa opholile kungase kuthuthukiswe kakhulu uma indawo engaphezulu ingavezwa emoyeni. Lawa masinki okushisa asebenza kahle asebenzisa i-epoxy egcwele i-aluminium esebenza ngokufudumeza ukuhlanganisa amaphiko epulaneti epuleti lesisekelo se-extrusion eligobile. Le nqubo ivumela isilinganiso esikhulu kakhulu se-fin height-to-gap sika-20 kuya ku-40, okwandisa kakhulu umthamo wokupholisa ngaphandle kokwandisa isidingo sevolumu.

 

 

 

- Ukusakaza: Isihlabathi, i-wax elahlekile kanye nezinqubo zokuphonsa ze-aluminium noma zethusi / zethusi ziyatholakala ngosizo lwe-vacuum noma ngaphandle. Sisebenzisa lobu buchwepheshe ekwenzeni amasinki okushisa amaphinikhodi aqinile ahlinzeka ngokusebenza okuphezulu uma kusetshenziswa ukupholisa kwe-impingement.

 

 

 

- Izinhlamvu ezigoqiwe: Ishidi likathayela lensimbi elivela ku-aluminium noma ithusi linyusa indawo engaphezulu kanye nokusebenza kwevolumu. Usinki wokushisa ube usunamathiselwa ku-base plate noma ngokuqondile endaweni yokushisisa nge-epoxy noma i-brazing. Ayiwafanele amasinki okushisa ephrofayili ephezulu ngenxa yokutholakala nokusebenza kahle kwe-fin. Ngakho-ke, ivumela amasinki okushisa asebenza kahle ukuthi enziwe.

 

 

 

Ekukhetheni isinki sokushisa esifanelekile esihlangabezana nemibandela yokushisa edingekayo yezinhlelo zakho zokusebenza ze-microelectronics, sidinga ukuhlola amapharamitha ahlukahlukene angathinti kuphela ukusebenza kweziko lokushisa ngokwalo, kodwa nokusebenza kwesistimu kukonke. Ukukhethwa kohlobo oluthile losinki wokushisa kuma-microelectronic kuncike kakhulu kusabelomali esishisayo esivunyelwe kusinki sokushisa nezimo zangaphandle ezizungeze usinki wokushisa. Alikho inani elilodwa lokumelana nokushisa elinikezwe kusinki okushisa esinikeziwe, njengoba ukumelana nokushisa kuyahlukahluka nezimo zokupholisa zangaphandle.

 

 

 

I-Sensor & Actuator Design and Fabrication: Kokubili i-off-shelf kanye nomklamo wangokwezifiso nokwenziwa kuyatholakala. Sinikeza izixazululo ezinezinqubo ezilungele ukusetshenziswa zezinzwa ze-inertial, izinzwa zengcindezi nezihlobene kanye namadivayisi enzwa ye-IR. Ngokusebenzisa amabhlogo ethu e-IP ama-accelerometer, i-IR nezinzwa zokucindezela noma ukusebenzisa idizayini yakho ngokuvumelana nezicaciso ezitholakalayo nemithetho yokuklama, singalethwa izinzwa ezisekelwe ku-MEMS zilethwe kuwe phakathi namaviki. Ngaphandle kwe-MEMS, ezinye izinhlobo zenzwa kanye nezinhlaka ze-actuator zingakhiwa.

 

 

 

Idizayini nokwakhiwa kwamasekhethi e-Optoelectronic & photonic: Isekethe ehlanganisiwe yesithombe noma i-optical (PIC) iyidivayisi ehlanganisa imisebenzi eminingi yezithombe. Ingase ifane namasekethe ahlanganisiwe we-elekthronikhi kuma-microelectronics. Umehluko omkhulu phakathi kwalokhu okubili ukuthi isifunda esihlanganisiwe se-photonic sinikeza ukusebenza kwamasignali olwazi abekwe kumaza wamaza okukhanya ku-spectrum ebonakalayo noma eduze kwe-infrared 850 nm-1650 nm. Amasu okwakha ayafana nalawo asetshenziswa kumasekhethi ahlanganisiwe e-microelectronics lapho i-photolithography isetshenziselwa ukwenza iphethini yamawafa okunamathisela kanye nokubeka izinto ezibonakalayo. Ngokungafani ne-semiconductor microelectronics lapho idivayisi eyinhloko kuyi-transistor, alikho idivayisi eyodwa elawulayo ku-optoelectronics. Ama-Photonic chips afaka phakathi ama-waveguide e-interconnect okulahlekelwa okuphansi, izihlukanisi zamandla, izikhulisa-zwi ezibonakalayo, ama-optical modulators, izihlungi, ama-lasers kanye nezitholi. Lawa madivaysi adinga izinhlobonhlobo zezinto ezihlukene kanye namasu okwenza izinto ngakho-ke kunzima ukuzibona zonke ku-chip eyodwa. Izicelo zethu zamasekethe ahlanganisiwe ezithombe ikakhulukazi zisezindaweni zokuxhumana nge-fiber-optic, biomedical kanye ne-photonic computing. Ezinye zezibonelo zemikhiqizo ye-optoelectronic esingakuklama futhi sikwakhele yona ama-LED (I-Light Emitting Diode), amalaser e-diode, izamukeli ze-optoelectronic, ama-photodiode, amamojula webanga le-laser, amamojula e-laser enziwe ngokwezifiso nokunye.