Ukukhiqiza I-Microscale / Micromanufacturing / Micromachining / MEMS

MICROMANUFACTURING, MICROSCALE MANUFACTURING, MICROFABRICATION or MICROMACHINING refers to our processes suitable for making tiny devices and products in the micron or microns of dimensions. Kwesinye isikhathi ubukhulu bomkhiqizo owenziwe ngezinto ezincane bungaba bukhulu, kodwa sisasebenzisa leli gama ukuze sibhekisele kumigomo nezinqubo ezihilelekile. Sisebenzisa indlela yokwenza i-micromanufacturing ukwenza izinhlobo ezilandelayo zamadivayisi:

 

 

 

Amadivayisi Angama-Microelectronic: Izibonelo ezijwayelekile ama-semiconductor chips asebenza ngokususelwe kuzimiso zikagesi neze-elekthronikhi.

 

Amadivayisi Ancane Kakhulu: Le yimikhiqizo enomshini ngokwemvelo njengamagiya amancane kakhulu namahinge.

 

Amadivayisi e-Microelectromechanical: Sisebenzisa amasu okukhiqiza ama-micromanufacturing ukuhlanganisa izakhi zomshini, zikagesi neze-elekthronikhi ngezikali zobude ezincane kakhulu. Iningi lezinzwa zethu likulesi sigaba.

 

I-Microelectromechanical Systems (MEMS): Lawa madivaysi e-microelectromechanical ahlanganisa nesistimu kagesi edidiyelwe emkhiqizweni owodwa. Imikhiqizo yethu yezentengiselwano edumile kulesi sigaba ama-MEMS accelerometers, izinzwa zesikhwama somoya kanye namadivayisi we-digital micromirror.

 

 

 

Ngokuya ngomkhiqizo ozokwenziwa, sisebenzisa enye yalezi zindlela ezinkulu ezilandelayo zokukhiqiza izinto ezincane:

 

I-BULK MICROMACHING: Lena indlela endala uma kuqhathaniswa esebenzisa ama-etches ancike kuma-orientation ku-silicon yekristalu eyodwa. Indlela ye-micromachining eyinqwaba isekelwe ekushoniseni endaweni engaphezulu, kanye nokuma ebusweni obuthile obuyikristalu, izifunda ezinezimbotshana, namafilimu acwengekayo ukuze kwakheke isakhiwo esidingekayo. Imikhiqizo ejwayelekile esikwazi ukuyenza micromanufacturing sisebenzisa inqwaba micromachining technique yile:

 

- Ama-cantilever amancane

 

- Ama-V-groves ku-silicon ukuze kulungiswe futhi kulungiswe imicu ye-optical.

 

I-MICROMACHINING YASEKHAYA: Ngeshwa i-micromachining eyinqwaba ikhawulelwe ezintweni zekristalu eyodwa, njengoba izinto ze-polycrystalline ngeke zisebenze ngamanani ahlukene ngezindlela ezihlukene zisebenzisa izinsimbi ezimanzi. Ngakho-ke i-surface micromachining igqama njengenye indlela ye-micromachining eyinqwaba. I-spacer noma isendlalelo somhlatshelo njengengilazi ye-phosphosilicate ifakwa kusetshenziswa inqubo ye-CVD ku-silicon substrate. Ngokuvamile, izingqimba zefilimu ezakhiwe ngesakhiwo se-polysilicon, insimbi, ama-alloys ensimbi, ama-dielectrics afakwa phezu kwe-spacer layer. Kusetshenziswa amasu okufaka okomile, izendlalelo zefilimu ezacile zesakhiwo zenziwe iphethini futhi ukucwiliswa okumanzi kusetshenziselwa ukususa ungqimba lomhlatshelo, ngaleyo ndlela kubangele izakhiwo ezikhululekile ezifana nama-cantilevers. Okungenzeka futhi ukusebenzisa inhlanganisela yenqwaba kanye namasu okwenziwa nge-micromachining ukuze uguqule imiklamo ethile ibe yimikhiqizo. Imikhiqizo ejwayelekile elungele ukwenziwa kwe-micromanufacturing isebenzisa inhlanganisela yamasu amabili angenhla:

 

- Usayizi we-submilimetric microlamps (ngokuhleleka kukasayizi we-0.1 mm)

 

- Izinzwa zokucindezela

 

- Amaphampu amancane

 

- Ama-Micromotors

 

- Ama-Actuator

 

- Amadivayisi we-Micro-fluid-flow

 

Kwesinye isikhathi, ukuze kutholwe izakhiwo ezime mpo eziphakeme, ukwenziwa kwe-micromanufacturing kwenziwa ezakhiweni ezinkulu eziyisicaba zivundlile bese izakhiwo zijikeleziswa noma zigoqwe zibe indawo eqondile kusetshenziswa amasu afana ne-centrifuging noma i-microassembly ngama-probe. Kodwa izakhiwo ezinde kakhulu zingatholakala ku-silicon eyodwa yekristalu kusetshenziswa i-silicon fusion bonding kanye ne-ion etching ejulile esebenzayo. Inqubo yokwenza i-Deep Reactive Ion Etching (DRIE) micromanufacturing yenziwa kumawafa amabili ahlukene, bese aqondaniswa futhi ahlanganiswe ukuze kukhiqizwe izakhiwo ezinde kakhulu ebezingeke zenzeke.

 

 

 

IZINQUBO ZE-LIGA ZOKWENZIWA KWEMICROMUFACTUR: Inqubo ye-LIGA ihlanganisa i-X-ray lithography, i-electrodeposition, ukubumba futhi ngokuvamile ihilela izinyathelo ezilandelayo:

 

 

 

1. Amakhulu ambalwa ama-microns ajiyile we-polymethylmetacrylate (PMMA) ukumelana nongqimba afakwa ku-substrate eyinhloko.

 

2. I-PMMA ithuthukiswa kusetshenziswa ama-X-ray ahlanganisiwe.

 

3. Insimbi ifakwa ku-electrodeposit ku-substrate eyinhloko.

 

4. I-PMMA iyakhunyulwa futhi isakhiwo sensimbi esizimele sihlala.

 

5. Sisebenzisa isakhiwo sensimbi esisele njengesikhunta futhi senza umjovo wokubunjwa kwamapulasitiki.

 

 

 

Uma uhlaziya izinyathelo ezinhlanu eziyisisekelo ngenhla, usebenzisa amasu e-LIGA micromanufacturing/micromachining esingawathola:

 

 

 

- Izakhiwo zensimbi ezizimele

 

- Izakhiwo zepulasitiki ezibunjiwe ngomjovo

 

- Sisebenzisa isakhiwo esibunjwe ngomjovo njengento engenalutho singatshala izingxenye zensimbi noma izingxenye ze-ceramic ezishibilikayo.

 

 

 

Izinqubo ze-LIGA micromanufacturing / micromachining zidla isikhathi futhi ziyabiza. Kodwa-ke, i-LIGA micromachining ikhiqiza lezi zibumba ezinembayo ezingasetshenziswa ukuphindaphinda izakhiwo ezifiselekayo ngezinzuzo ezihlukile. I-LIGA micromanufacturing ingasetshenziswa njengesibonelo ukwenza omazibuthe abancane abaqine kakhulu ngezimpushana zomhlaba eziyivelakancane. Izimpushana zomhlaba eziyivelakancane zixutshwa ne-epoxy binder bese zicindezelwa kusikhunta se-PMMA, zelashwe ngaphansi kwengcindezi ephezulu, zifakwe uzibuthe ngaphansi kwezindawo ezinamandla kazibuthe futhi ekugcineni i-PMMA iyancibilika kushiye ngemuva izibuthe ezincane ezinamandla eziyivelakancane ezingesinye sezimangaliso. micromanufacturing / micromachining. Siyakwazi futhi ukuthuthukisa amasu e-MEMS micromanufacturing/micromachining amasu nge-wafer-scale diffusion bonding. Ngokuyisisekelo singaba namajiyometri alengayo ngaphakathi kwamadivayisi we-MEMS, sisebenzisa i-batch diffusion bonding kanye nenqubo yokukhulula. Isibonelo silungiselela izendlalelo ezimbili ezinephethini ne-electroformed PMMA nge-PMMA ekhishwa kamuva. Okulandelayo, ama-wafer aqondaniswe ubuso nobuso namaphini omhlahlandlela bese ucindezela ukuhlanganisa ndawonye emshinini wokushisa oshisayo. Isendlalelo somhlatshelo kwenye yama-substrates siyaqoshwa okuholela kokuthi izendlalelo eziboshelwe kwenye. Amanye amasu okwenza i-micromanufacturing okungeyona i-LIGA ayatholakala kithi ukuze enze izakhiwo eziyinkimbinkimbi zezendlalelo eziningi.

 

 

 

IZINQUBO ZE-SOLID FREEFORM MICROFABRICATION: I-Additive micromanufacturing isetshenziselwa ukwenza i-prototyping ngokushesha. Izakhiwo eziyinkimbinkimbi ze-3D zingatholwa ngale ndlela ye-micromachining futhi akukho ukususwa kwezinto okwenzekayo. Inqubo ye-Microstereolithography isebenzisa ama-polymers e-thermosetting ewuketshezi, i-photoinitiator kanye nomthombo we-laser ogxile kakhulu kububanzi obuncane obungange-micron engu-1 kanye nogqinsi lwesendlalelo esingaba ama-microns ayi-10. Le ndlela yokwenza i-micromanufacturing inqunyelwe ukukhiqizwa kwezakhiwo ze-polymer ezingaqhubi. Enye indlela yokwenza izinto ezincane, okungukuthi “ukufihla ubuso okusheshayo” noma eyaziwa nangokuthi “i-electrochemical fabrication” noma i-EFAB ibandakanya ukukhiqizwa kwemaski elastomeric kusetshenziswa i-photolithography. Imaski ibe isicindezelwa ku-substrate endaweni yokugeza ye-electrodeposition ukuze i-elastomer ihambisane ne-substrate futhi ingafaki isixazululo sokucwenga ezindaweni zokuthintana. Izindawo ezingamboziwe zifakwe ugesi njengesithombe sesibuko semaski. Ngokusebenzisa isigcwalisi somhlatshelo, umumo we-3D oyinkimbinkimbi wenziwa nge-microfabricated. Le ndlela “yokufihla ubuso esheshayo” ye-micromanufacturing/micromachining yenza kube nokwenzeka futhi ukukhiqiza ama-overhangs, ama-arches…njll.