Search Results

Plasma Machining - HF Plasma Cutting - Plasma Gouging - CNC - Plasma Arc Welding - PAW - GTAW - AGS-TECH Inc. - New Mexico I-Plasma Machining & Cutting We use the PLASMA CUTTING and PLASMA MACHINING processes to cut and machine steel, aluminum, metals and other materials of ubukhulu obuhlukahlukene kusetshenziswa ithoshi ye-plasma. Ekusikeni i-plasma (ebuye ngezinye izikhathi kubizwe ngokuthi PLASMA-ARC CUTTING), igesi engasebenzi noma umoya ocindezelwe uvunguza ngesivinini esikhulu uphuma emlonyeni bese kanyekanye kwakheka i-arc kagesi ngaleyo gesi isuka kumphumulo iye kuye. ingaphezulu liyasikwa, kuguqule ingxenye yaleyo gesi ibe i-plasma. Ukwenza lula, i-plasma ingachazwa njengesimo sesine sezinto. Izimo ezintathu zodaba ziqinile, ziwuketshezi kanye negesi. Isibonelo esivamile, amanzi, lezi zifunda ezintathu ziyiqhwa, amanzi kanye ne-steam. Umehluko phakathi kwalezi zifundazwe uhlobene namazinga azo wamandla. Uma sengeza amandla ngendlela yokushisa eqhweni, liyancibilika bese kwakheka amanzi. Uma sengeza amandla engeziwe, amanzi ayahwamuka abe isitimu. Ngokungeza amandla engeziwe ukuze lawa magesi abe ionized. Le nqubo ye-ionization ibangela ukuthi igesi isebenze ngogesi. Lokhu sikubiza ngegesi eqhutshwa ngogesi, ene-ionized “plasma”. I-plasma ishisa kakhulu futhi incibilikisa insimbi esikwayo futhi ngesikhathi esifanayo iphephetha insimbi encibilikisiwe kude ne-cut. Sisebenzisa i-plasma ukusika izinto ezizacile neziwugqinsi, ezisansimbi nezingenayo i-ferrous ngokufanayo. Amathoshi ethu aphathwa ngesandla ngokuvamile angasika amapuleti ensimbi awugqinsi amayintshi angu-2, futhi amathoshi ethu anamandla alawulwa ngekhompuyutha angasika insimbi ifike kumayintshi angu-6 ubukhulu. Abasiki be-Plasma bakhiqiza ikhoni eshisa kakhulu neyendawo ukusika ngayo, ngakho-ke bafaneleka kakhulu ukusika amashidi ensimbi ngamajamo agobile nangama-engeli. Amazinga okushisa akhiqizwa ekusikeni kwe-plasma-arc aphezulu kakhulu futhi azungeze i-9673 Kelvin ethoshi le-plasma ye-oxygen. Lokhu kusinikeza inqubo esheshayo, ububanzi be-kerf encane, nokuqedwa okuhle kwendawo. Kumasistimu ethu asebenzisa ama-electrode e-tungsten, i-plasma ayisebenzi, yakhiwe kusetshenziswa i-argon, i-argon-H2 noma amagesi e-nitrogen. Kodwa-ke, ngezinye izikhathi sisebenzisa amagesi oxidizing, afana nomoya noma umoya-mpilo, futhi kulawo masistimu i-electrode iyithusi eline-hafnium. Inzuzo yethoshi ye-air plasma ukuthi isebenzisa umoya esikhundleni samagesi abizayo, ngaleyo ndlela inciphise izindleko zizonke zokwenza imishini . Imishini yethu HF-TYPE PLASMA CUTTING machine isebenzisa imvamisa ephezulu, ipaka phezulu ukuze ifinyelele i-air-voltage ekhanda. Abasiki bethu be-plasma be-HF abadingi ukuthi ithoshi lixhumane nezinto zokusebenza ekuqaleni, futhi bafanele izicelo ezibandakanya COMPUTER NUMERICAL CONTROL (CNC)_cc781905-9cf358bbd-3194-5cde-6b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b3b31905-58d_COMPUTER Abanye abakhiqizi basebenzisa imishini yakudala edinga ukuthintana nensimbi yomzali ukuze kuqalwe bese kuba nokuhlukana kwegebe. Laba basiki be-plasma bakudala bangenwa kalula ithiphu futhi bavikele ukulimala ekuqaleni. Imishini yethu PILOT-ARC TYPE PLASMA machines isebenzisa izinyathelo ezimbili zokukhiqiza i-plasma, ngaphandle kokuxhumana kokuqala. Esinyathelweni sokuqala, i-high-voltage, isekethe yamanje ephansi isetshenziselwa ukuqalisa inhlansi encane kakhulu yokuqina okuphezulu ngaphakathi komzimba wethoshi, ikhiqize iphakethe elincane legesi ye-plasma. Lokhu kubizwa ngokuthi i-pilot arc. I-arc yomshayeli inomzila kagesi obuyayo owakhiwe ekhanda lethoshi. I-pilot arc iyagcinwa futhi igcinwe kuze kube yilapho ilethwa eduze nendawo yokusebenza. Lapho i-arc yomshayeli ithungela i-arc eyinhloko yokusika i-plasma. Ama-Plasma arcs ashisa kakhulu futhi asebangeni elingu-25,000 °C = 45,000 °F. Enye indlela yendabuko esiyisebenzisayo ithi OXYFUEL-GAS CUTTING (OFC) lapho sisebenzisa khona ithoshi. Ukusebenza kusetshenziselwa ukusika insimbi, insimbi ekhonjiwe kanye nensimbi ekhonjiwe. Umgomo wokusika ekusikeni kwe-oxyfuel-gas kusekelwe ku-oxidation, ukushisa nokuncibilika kwensimbi. Ububanzi be-Kerf ekusikeni kwe-oxyfuel-gas busendaweni engu-1.5 ukuya ku-10mm. Inqubo ye-plasma arc ibonwe njengenye indlela yenqubo ye-oxy-fuel. Inqubo ye-plasma-arc ihluke kunqubo ye-oxy-fuel ngoba isebenza ngokusebenzisa i-arc ukuncibilikisa insimbi kuyilapho inqubo ye-oxy-fuel, i-oksijini i-oxidize insimbi futhi ukushisa okuvela ekuphenduleni kwe-exothermic kuncibilikisa insimbi. Ngakho-ke, ngokungafani nenqubo ye-oxy-fuel, inqubo ye-plasma ingasetshenziswa ekusikeni izinsimbi ezakha ama-oxide aphikisayo njengensimbi engagqwali, i-aluminium, nama-alloys angewona ayoni. I-PLASMA GOUGING inqubo efanayo yokusika i-plasma, ngokuvamile yenziwa ngezinto ezifanayo zokusika i-plasma. Esikhundleni sokusika i-material, i-plasma gouging isebenzisa ukucushwa kwethoshi okuhlukile. Umbhobho wethoshi nesihlukanisi segesi kuvame ukuhluka, futhi ibanga elide ukusuka kwithoshi ukuya emsebenzini liyagcinwa ukuze kuphephethwe insimbi. I-Plasma gouging ingasetshenziswa ezinhlelweni ezahlukahlukene, kufaka phakathi ukususa i-weld ukuze isebenze kabusha. Abanye abasiki bethu be-plasma bakhelwe etafuleni le-CNC. Amatafula e-CNC anekhompyutha yokulawula ikhanda lethoshi ukuze akhiqize ukusikeka okucijile okuhlanzekile. Imishini yethu yesimanje ye-CNC plasma iyakwazi ukusika izinto eziwugqinsi ezinama-axis amaningi futhi ivumela amathuba emishini yokushisela eyinkimbinkimbi engenakwenzeka ngenye indlela. Abasiki bethu be-plasma-arc bazenzakalela kakhulu ngokusebenzisa izilawuli ezihlelekayo. Ngezinto zokwakha ezizacile, sincamela ukusika i-laser kunokusika i-plasma, ikakhulukazi ngenxa yamakhono ethu okusika imbobo e-laser aphakeme. Siphinde sisebenzisa imishini yokusika i-plasma ye-CNC eqondile, esinika unyawo oluncane, ukuguquguquka okukhulayo, ukuphepha okungcono nokusebenza okusheshayo. Izinga le-plasma cut edge lifana nalelo elizuzwe ngezinqubo zokusika i-oxy-fuel. Kodwa-ke, ngenxa yokuthi inqubo ye-plasma iyancibilika, isici esiyisici yizinga elikhulu lokuncibilika ukuya phezulu kwensimbi okuholela ekuzungelezeni konqenqema olungaphezulu, unqenqema olungesikwele olubi noma i-bevel onqenqemeni olusikiwe. Sisebenzisa amamodeli amasha amathoshi e-plasma anenozzle encane kanye ne-plasma arc ezacile ukuze sithuthukise i-arc constriction ukuze sikhiqize ukushisisa okufanayo okuphezulu phezulu nangaphansi kokusikwa. Lokhu kusivumela ukuthi sithole ukunemba okuseduze kwelaser ekusikeni kwe-plasma nemiphetho eyenziwe ngomshini. Our HIGH TOLERANCE I-PLASMA ARC CUTTING (HTPAC) systems isebenza ngeplasma eminyene kakhulu. Ukugxila kwe-plasma kufinyelelwa ngokuphoqelela i-plasma ekhiqizwe umoya-mpilo ukuthi ijikeleze njengoba ingena egodini le-plasma futhi ukugeleza kwesibili kwegesi kufakwa ngezansi komfula we-plasma. Sinenkambu kazibuthe ehlukile ezungeze i-arc. Lokhu kuzinzisa ijethi ye-plasma ngokugcina ukujikeleza okubangelwa igesi ezungezayo. Ngokuhlanganisa ukulawula okunembayo kwe-CNC nalawa mathoshi amancane nancanyana siyakwazi ukukhiqiza izingxenye ezidinga ukuqedwa okuncane noma ezingaqedi nhlobo. Amazinga okususwa kwezinto ku-plasma-machining aphakeme kakhulu kunezinqubo ze-Electric-Discharge-Machining (EDM) kanye ne-Laser-Beam-Machining (LBM), futhi izingxenye zingenziwa ngomshini ngokukhiqiza kabusha okuhle. I-PLASMA ARC WELDING (PAW) iyinqubo efana ne-gas tungsten arc welding (GTAW). I-arc kagesi yakhiwa phakathi kwe-electrode ngokuvamile eyenziwe nge-sintered tungsten kanye nomsebenzi. Umehluko oyinhloko ovela ku-GTAW ukuthi ku-PAW, ngokubeka i-electrode ngaphakathi komzimba wethoshi, i-arc ye-plasma ingahlukaniswa nemvilophu yegesi evikelayo. I-plasma ibe isiphoqwa ngombhobho wethusi obhoboze kahle ohlanganisa i-arc kanye ne-plasma ephuma egodini ngesivinini esiphezulu futhi amazinga okushisa asondele ku-20,000 °C. Ukushisela i-Plasma arc kuyintuthuko ngaphezu kwenqubo ye-GTAW. Inqubo yokushisela i-PAW isebenzisa i-electrode ye-tungsten engadleki kanye ne-arc eboshwe ngembobo yethusi ebhoboze kahle. I-PAW ingasetshenziswa ukuhlanganisa zonke izinsimbi nama-alloys ashisela nge-GTAW. Izinguquko ezimbalwa eziyisisekelo zenqubo ye-PAW zingenzeka ngokushintsha izinga lokugeleza kwegesi ye-plasma yamanje, kanye nobubanzi be-orifice, okuhlanganisa: I-Micro-plasma (< 15 Amperes) Imodi yokuncibilika (15–400 Amperes) Imodi ye-keyhole (>100 Amperes) Ku-plasma arc welding (PAW) sithola ukugxila okukhulu kwamandla uma kuqhathaniswa ne-GTAW. Ukungena okujulile nokuncane kuyafezeka, ngokujula okuphezulu kuka-12 kuya ku-18 mm (0.47 kuya ku-0.71 in) kuye ngokuthile. Ukuzinza kwe-arc okukhulu kuvumela ubude be-arc ende (ukuma), nokubekezelela okukhulu kakhulu ekushintsheni kobude be-arc. Njengobubi nokho, i-PAW idinga amathuluzi abizayo futhi ayinkimbinkimbi uma kuqhathaniswa ne-GTAW. Futhi ukugcinwa kwethoshi kubalulekile futhi kuyinselelo enkulu. Okunye okungalungile kwe-PAW yilezi: Izinqubo zokushisela zivame ukuba yinkimbinkimbi kakhulu futhi zingakwazi ukubekezelela ukuhluka kokulingana, njll. Ikhono lomsebenzisi elidingekayo lingaphezudlwana kwe-GTAW. Ukushintshwa kwe-Orifice kuyadingeka. CLICK Product Finder-Locator Service IKHASI ELIDLULE

Electronic Components, Diodes, Transistors - Resistors, Thermoelectric Cooler, Heating Elements, Capacitors, Inductors, Driver, Device Sockets and Adapters Izingxenye zikagesi neze-elekthronikhi nama-Assemblies Njengomkhiqizi wangokwezifiso kanye nesihlanganisi sobunjiniyela, i-AGS-TECH ingakunikeza okulandelayo ELECTRONIC COMPONENTS kanye nama-ASSEMBLIES: • Izingxenye ze-elekthronikhi ezisebenzayo nezingenzi lutho, izisetshenziswa, ama-subassemblies kanye nemikhiqizo eqediwe. Singasebenzisa izingxenye ze-elekthronikhi kumakhathalogi nezincwajana zethu ezibalwe ngezansi noma sisebenzise izingxenye zabakhiqizi ozincamelayo ekuhlanganiseni kwakho imikhiqizo ye-elekthronikhi. Ezinye zezingxenye ze-elekthronikhi kanye nokuhlangana kungenziwa ngokwezifiso ngokwezidingo zakho kanye nezidingo zakho. Uma inani le-oda lakho lifaneleka, singaba nemboni yokukhiqiza ikhiqize ngokuya ngemininingwane yakho. Ungaskrolela phansi bese ulanda izincwajana zethu ozithakaselayo ngokuchofoza umbhalo ogqanyisiwe: Izingxenye ze-off-shelf interconnect kanye ne-hardware I-Terminal Blocks kanye Nezixhumi Ikhathalogi Ejwayelekile Yezibhulokhi Zetheminali Ikhathalogi Yezixhumi-Amandla Okungena-Izixhumi Ama-chip resistors Umugqa womkhiqizo we-chip resistors Ama-Varistors Uhlolojikelele lomkhiqizo we-Varistors Ama-Diodes nama-rectifiers Amadivayisi e-RF kanye nama-inductors amafrikhwensi aphezulu Ishadi Lokubukezwa Komkhiqizo we-RF Umugqa womkhiqizo wamadivayisi wemvamisa ephezulu 5G - LTE 4G - LPWA 3G - 2G - GPS - GNSS - WLAN - BT - Combo - ISM Antenna-Brochure Ikhathalogi ye-MLCC yama-Cramic capacitors amaningi Multilayer Ceramic capacitors MLCC umkhiqizo line Ikhathalogi ye-Disc capacitors I-Zeasset Model Electrolytic Capacitors I-Yaren Model MOSFET - SCR - FRD - Amadivayisi Okulawula Amandla Kagesi - Ama-Bipolar Transistors Ama-Soft Ferrites - Ama-Cores - Ama-Toroids - Imikhiqizo Yokucindezela kwe-EMI - Ibhukwana le-RFID Transponders kanye Nezesekeli • Ezinye izingxenye ze-elekthronikhi nokuhlanganisa ebesikunikeza izinzwa zokucindezela, izinzwa zokushisa, izinzwa ze-conductivity, izinzwa eziseduze, izinzwa zomswakama, inzwa yesivinini, inzwa yokushaqeka, inzwa yamakhemikhali, inzwa yokuthambekela, iseli yomthwalo, amageji e-strain. Ukulanda amakhathalogi ahlobene nezincwajana zalokhu, sicela uchofoze umbhalo onemibala: Izinzwa zokucindezela, izikali zokucindezela, ama-transducer nama-transmitters I-Thermal Resistor Temperature Transducer UTC1 (-50~+600 C) I-Thermal Resistor Temperature Transducer UTC2 (-40~+200 C) I-Explosive Temperature Transmitter ye-UTB4 I-Integrated Temperature Transmitter UTB8 I-Smart Temperature Transmitter UTB-101 I-Din Rail Mounted Temperature Transmitters UTB11 I-Temperature Pressure Integration Transmitter UTB5 I-Digital Temperature Transmitter UTI2 Intelligent Temperature Transmitter UTI5 I-Digital Temperature Transmitter UTI6 I-Wireless Digital Temperature Gauge UTI7 I-Electronic Temperature Switch UTS2 Ama-Transmitter Wokushisa Wokushisa Layisha amaseli, izinzwa zesisindo, amageji omthwalo, ama-transducer nama-transmitters Isistimu yokufaka ikhodi yamageji e-off-shelf strain Ama-Strain Gauges Okuhlaziya Ingcindezi Izinzwa eziseduze Amasokhethi kanye nezinsiza zezinzwa eziseduze • Amadivayisi asuselwa ku-Chip level micrometer scale ama-Microelectromechanical Systems (MEMS) afana nama-micropump, ama-micromirror, ama-micromotor, ama-microfluidic device. • Izifunda Ezihlanganisiwe (IC) • Ukushintsha ama-elementi, shintsha, i-relay, i-contactor, i-circuit breaker Inkinobho yokucisha namaswishi ajikelezayo namabhokisi okulawula I-Sub-Miniature Power Relay ene-UL ne-CE Certification JQC-3F100111-1153132 I-Miniature Power Relay ene-UL ne-CE Certification JQX-10F100111-1153432 I-Miniature Power Relay ene-UL kanye nezitifiketi ze-CE JQX-13F100111-1154072 Ama-Miniature Circuit Breakers ane-UL kanye ne-CE Certification NB1100111-1114242 I-Miniature Power Relay ene-UL kanye ne-CE Certification JTX100111-1155122 I-Miniature Power Relay ene-UL kanye ne-CE Certification MK100111-1155402 I-Miniature Power Relay ene-UL ne-CE Certification NJX-13FW100111-1152352 I-Electronic Overload Relay ene-UL kanye ne-CE Certification NRE8100111-1143132 I-Thermal Overload Relay ene-UL ne-CE Certification NR2100111-1144062 Oxhumana nabo abane-UL kanye ne-CE Certification NC1100111-1042532 Oxhumana nabo abane-UL kanye ne-CE Certification NC2100111-1044422 Oxhumana nabo abane-UL kanye ne-CE Certifications NC6100111-1040002 Inhloso Eqinisekile Yokuxhumana Nezitifiketi ze-UL kanye ne-CE NCK3100111-1052422 • Amafeni kagesi nama-coolers azofakwa kumishini kagesi neyezimboni • Izinto zokushisisa, ama-thermoelectric coolers (TEC) Amasinki okushisa ajwayelekile Amasinki okushisa angeziwe Amasinki okushisa Amandla Amandla Amandla aphezulu amasistimu kagesi anamandla aphakathi nendawo Amasinki okushisa aneSuper Fins I-Easy Click heat sinks Super cooling plate Amapuleti okupholisa angenamanzi • Sinikezela nge-Electronic Enclosures ukuze sivikele izingxenye zakho ze-elekthronikhi nokuhlanganisa. Ngaphandle kwalezi zindawo ezivalekile zikagesi ezingaphandle kweshalofu, senza isikhunta somjovo wangokwezifiso kanye nezibiyelo zikagesi ze-thermoform ezilingana nemidwebo yakho yobuchwepheshe. Sicela ulande kuzixhumanisi ezingezansi. I-Tibox Model Enclosures namaKhabhinethi Economic 17 Series Ebanjwe Isandla Ezivalekile 10 Series Plastic Ezivalekile Ezivalekile 08 Series Plastic Cases 18 Series Special Plastic Enclosures 24 Series DIN Plastic Ezivalekile 37 Series Plastic Equipment Cases 15 Series Modular Plastic Enclosures 14 Series PLC Enclosures 31 Series Potting kanye Power Supply Enclosure 20 Series Ezifaka Odongeni Ezivalekile 03 Series Plastic and Steel Enclosures 02 Series Plastic and Aluminium Instrument Case Systems II 01 Series Instrument Case System-I 05 Series Instrument Case System-V 11 Series Die-cast Aluminium Amabhokisi 16 Series DIN ujantshi ezivalekile 19 Series Desktop Enclosures 21 Series Card Reader Ezivalekile • Imikhiqizo yezokuxhumana kanye nedatha yezokuxhumana, amalaser, izamukeli, ama-transceivers, ama-transponder, amamoduli, izikhulisa-msindo. Imikhiqizo ye-CATV efana ne-CAT3, i-CAT5, i-CAT5e, i-CAT6, izintambo ze-CAT7, izihlukanisi ze-CATV. • Izingxenye ze-laser nokuhlanganisa • Izingxenye ze-Acoustic nama-assemblies, ama-electronics aqoshiwe - Lawa makhathalogi aqukethe kuphela izinhlobo ezithile esizithengisayo. Futhi sinamagama emikhiqizo ejwayelekile kanye namanye amabhrendi anekhwalithi enhle efanayo ongakhetha kuyo. Dawuniloda incwajana yethu KALA UHLELO LOKUBAMBISANA - Xhumana nathi ngezicelo zakho ezikhethekile zomhlangano we-elekthronikhi. Sihlanganisa izingxenye nemikhiqizo ehlukahlukene futhi sikhiqize imihlangano eyinkimbinkimbi. Singakuklama yona noma sikuhlanganise ngokuya ngomklamo wakho. Ikhodi Yereferensi: OICASANLY CLICK Product Finder-Locator Service IKHASI ELIDLULE

Micro Assembly & Packaging - Micromechanical Fasteners - Self Assembly - Adhesive Micromechanical Fastening - AGS-TECH Inc. - New Mexico - USA I-Micro Assembly kanye nokupakishwa Sesivele sifingqa izinkonzo zethu MICRO ASSEMBLY & PACKAGING services kanye nemikhiqizo ehlobene ngokuqondile ne-11d58d_electronic741d58d_elektronikhiUkukhiqiza I-Microelectronics / Semiconductor Fabrication. Lapha sizogxila ekuhlanganiseni nasekupakisheni izinto ezincane ezijwayelekile kanye nasemhlabeni wonke esizisebenzisa kuzo zonke izinhlobo zemikhiqizo okuhlanganisa imishini, i-optical, microelectronic, optoelectronic kanye namasistimu ayingxube ahlanganisa inhlanganisela yalokhu. Amasu esixoxa ngawo lapha ahlukahlukene kakhulu futhi angabhekwa njengasetshenziswa ezinhlelweni ezingajwayelekile nezingajwayelekile. Ngamanye amazwi amasu okuhlanganisa nokupakisha okuxoxwe ngawo lapha angamathuluzi ethu asisiza ukuba sicabange “ngaphandle kwebhokisi”. Nazi ezinye zezindlela zethu ezingavamile zokuhlanganisa nezindlela zokupakisha: - Manual micro assembly & emaphaketheni - Ukuhlanganiswa kwe-micro okuzenzakalelayo nokupakishwa - Izindlela zokuzihlanganisa ngokwakho njengokuzihlanganisa kwe-fluid - Umhlangano omncane we-Stochastic usebenzisa ukudlidliza, amandla adonsela phansi noma amandla kagesi noma okunye. - Ukusetshenziswa kwe-micromechanical fasteners - I-Adhesive micromechanical fastening Ake sihlole ezinye zezindlela zethu eziguquguqukayo ze-microassembly nezindlela zokupakisha ngemininingwane eyengeziwe. UMHLANGANO WE-MICRO WEMANUAL NOKUPAKASHA: Ukusebenza okwenziwa mathupha kungabiza izindleko futhi kudinga izinga lokunemba elingase lingenzeki ku-opharetha ngenxa yobunzima obubangela emehlweni kanye nemikhawulo yobuchule obuhlobene nokuhlanganisa izingxenye ezinjalo ezincane ngaphansi kwesibonakhulu. Kodwa-ke, ukuhlanganiswa kwezinhlelo zokusebenza ezikhethekile zevolumu ephansi kungase kube inketho engcono kakhulu ngoba ayidingi ukuklama nokwakhiwa kwezinhlelo zokuhlanganisa ezincane ezizenzakalelayo. UMHLANGANO WE-MICRO OKUZENZAKALELAYO NOKUPAKASHA: Amasistimu ethu okuhlanganisa amancane aklanyelwe ukwenza ukuhlanganisa kube lula futhi kungabizi kakhulu, okuvumela ukuthuthukiswa kwezinhlelo zokusebenza ezintsha zobuchwepheshe bemishini emincane. Singakwazi ukuhlanganisa amadivayisi amancane nezingxenye kubukhulu bezinga le-microns sisebenzisa amasistimu wamarobhothi. Nawa amanye ama-automated micro assembly & nempahla yokupakisha namandla: • Imishini yokulawula ukunyakaza kwezinotshi eziphezulu okuhlanganisa iseli yokusebenza yerobhothi enokulungiswa kwendawo ye-nanometric • Amangqamuzana okusebenza aqhutshwa nge-CAD ngokugcwele okuhlanganisa okuncane • Izindlela ze-Fourier optics zokukhiqiza izithombe zokwenziwa zemakroskopu kusuka emidwebeni ye-CAD ukuhlola izindlela zokucubungula izithombe ngaphansi kokukhulisa nokujula kwenkambu (DOF) • Ukuklama ngokwezifiso kanye namandla okukhiqiza ama-micro tweezers, ama-manipulator nama-actuator ukuze kuhlanganiswe nokupakishwa okuncane • Laser interferometers • Hlunga ama-gages ukuze uthole impendulo ngenkani • Umbono wekhompyutha wesikhathi sangempela wokulawula izinqubo ze-servo namamotho wokuqondanisa okuncane kanye nokuhlangana okuncane kwezingxenye ezinokubekezelelwa kwe-sub-micron • Iskena i-Electron Microscopes (SEM) kanye ne-Transmission Electron Microscopes (TEM) • I-12 degrees yenkululeko ye-nano manipulator Inqubo yethu yokuhlanganisa encane ezenzakalelayo ingabeka amagiya amaningi noma ezinye izingxenye kokuthunyelwe okuningi noma izindawo ngesinyathelo esisodwa. Amakhono ethu okukhohlisa makhulu kakhulu. Silapha ukuze sikusize ngemibono engajwayelekile engajwayelekile. IZINDLELA ZOKUZIHLANGANISA KA-MICRO NE-NANO: Ekuzihlanganiseni kwezinqubo isistimu ephazamisekile yezingxenye ezikhona ngaphambili yakha isakhiwo esihleliwe noma iphethini njengomphumela wokusebenzisana okuqondile, kwendawo phakathi kwezingxenye, ngaphandle kokuqondisa kwangaphandle. Izingxenye ezizihlanganisayo zithola ukusebenzisana kwendawo kuphela futhi ngokuvamile zithobela isethi elula yemithetho ebusa ukuthi zihlangana kanjani. Ngisho noma lesi simo sizimele futhi singasetshenziselwa ukuzakhela kanye nezinhlelo zokukhiqiza cishe kuzo zonke izikali, sigxile ekuhlanganiseni okuncane nokuzihlanganisa kwe-nano. Ekwakheni amadivaysi amancane, omunye wemibono ethembisa kakhulu ukusebenzisa inqubo yokuzihlanganisa. Izakhiwo eziyinkimbinkimbi zingadalwa ngokuhlanganisa amabhlogo wokwakha ngaphansi kwezimo zemvelo. Ukwenza isibonelo, kumiswa indlela yokuhlanganisa ama-micro amaqoqo amaningi wezingxenye ezincane ku-substrate eyodwa. I-substrate ilungiswa ngezindawo zokubopha igolide ezine-hydrophobic. Ukwenza ukuhlanganiswa okuncane, uwoyela we-hydrocarbon usetshenziswa ku-substrate bese umanzisa kuphela izindawo zokubopha i-hydrophobic emanzini. Izingxenye ezincane zibe sezifakwa emanzini, futhi zihlanganiswe ezindaweni zokubopha ezimanziswe ngamafutha. Ngaphezu kwalokho, ukuhlanganiswa okuncane kungalawulwa ukuze kwenzeke ezindaweni ezifiselekayo zokubopha ngokusebenzisa indlela ye-electrochemical ukuze kucishwe amasayithi athile okubopha ama-substrate. Ngokusebenzisa le ndlela ngokuphindaphindiwe, amaqoqo ahlukene ezingxenye ezincane angaqoqwa ngokulandelana ku-substrate eyodwa. Ngemuva kwenqubo yokuhlanganisa encane, i-electroplating iyenzeka ukuze kusungulwe uxhumano lukagesi lwezingxenye ezincane ezihlanganisiwe. UMHLANGANO WE-STOCHASTIC MICRO: Emhlanganweni omncane ofanayo, lapho izingxenye zihlanganiswa ngasikhathi sinye, kuba nomhlangano omncane we-deterministic kanye ne-stochastic. Emhlanganweni omncane we-deterministic, ubudlelwano phakathi kwengxenye nendawo eya kuyo ku-substrate baziwa kusengaphambili. Ngakolunye uhlangothi, kumhlangano omncane we-stochastic, lobu budlelwano akwaziwa noma akuhleliwe. Izingxenye ziyazihlanganisa ngokwazo ezinqubweni ze-stochastic eziqhutshwa amandla athile ashukumisayo. Ukuze ukuzihlanganisa okuncane kwenzeke, kudingeka kube namandla okubopha, ukubopha kudinga ukwenzeka ngokukhetha, futhi izingxenye ezincane ezihlanganisayo zidinga ukwazi ukuhamba ukuze zihlangane. Ukuhlanganiswa kwe-Stochastic micro izikhathi eziningi kuhambisana nokudlidliza, i-electrostatic, i-microfluidic noma amanye amandla asebenza ezingxenyeni. I-Stochastic micro assembly iwusizo ikakhulukazi uma amabhulokhi wokwakha amancane, ngoba ukuphatha izingxenye zomuntu ngamunye kuba yinselele enkulu. Ukuzihlanganisa kwe-Stochastic kungabonwa nasemvelweni. IZIQINISEKISO ZE-MICROMECHANICAL: Esikalini esincane, izinhlobo ezivamile zokubopha njengezikulufi namahinge ngeke zisebenze kalula ngenxa yezinkinga zokwenziwa ezikhona namandla amakhulu okungqubuzana. Ngakolunye uhlangothi izibophelelo ze-Micro snap zisebenza kalula ezinhlelweni zokuhlanganisa ezincane. Ama-Micro snap fasteners angamadivayisi akhubazekayo ahlanganisa amapheya ezindawo zokukhwelana ezihlanganayo ngesikhathi sokuhlanganisa okuncane. Ngenxa yokunyakaza kokuhlanganisa okulula nokuqondile, izixhumi ze-snap zinezinhlobonhlobo zezinhlelo zokusebenza ekusebenzeni komhlangano omncane, njengamadivayisi anezingxenye eziningi noma ezinezingqimba, noma amapulagi ama-micro opto-mechanical, izinzwa ezinenkumbulo. Ezinye izibophelelo zokuhlanganisa ezincane amajoyinti “e-key-lock” kanye namajoyinti “e-inter-lock”. Amalunga okukhiya ukhiye ahlanganisa ukufakwa “kokhiye” engxenyeni encane eyodwa, endaweni yokukhwelana kwenye ingxenye encane. Ukukhiya endaweni kufinyelelwa ngokuhumusha ingxenye encane yokuqala phakathi kwenye. Amajoyinti e-Inter-lock adalwe ngokufaka i-perpendicular yengxenye eyodwa encane ene-slit, kwenye ingxenye encane ene-slit. Ama-slits adala ukulingana kokuphazamiseka futhi ahlala unomphela uma izingxenye ezincane sezihlanganisiwe. I-Adhesive MICROMECHANICAL FASTENING: I-Adhesive mechanical fastening isetshenziselwa ukwakha amadivaysi amancane e-3D. Inqubo yokubopha ihlanganisa izindlela zokuziqondanisa kanye ne-adhesive bonding. Izindlela zokuziqondanisa zisatshalaliswa ekuhlanganiseni okuncane okunamathelayo ukuze kwandiswe ukunemba kokuma. I-micro probe exhunywe kumshini we-robotic micromanipulator iyacosha futhi ifake ngokunembile okunamathelayo ezindaweni eziqondiwe. Ukukhanya okwelaphayo kwenza i-adhesive ibe lukhuni. I-adhesive eselashiwe igcina izingxenye ezincane ezihlanganisiwe ezindaweni zazo futhi inikeza amalunga aqinile wemishini. Ukusebenzisa i-adhesive conductive, uxhumano lukagesi oluthembekile lungatholakala. I-adhesive mechanical fastening idinga kuphela imisebenzi elula, futhi ingabangela ukuxhumana okuthembekile kanye nokunemba kokubeka okuphezulu, okubalulekile ku-microassembly othomathikhi. Ukubonisa ukuthi kungenzeka le ndlela, amadivaysi amaningi e-MEMS anezinhlangothi ezintathu ahlanganiswe kancane, okuhlanganisa neswishi ye-3D rotary optical. CLICK Product Finder-Locator Service IKHASI ELIDLULE

Microelectronics Manufacturing, Semiconductor Fabrication - Foundry - FPGA - IC Assembly Packaging - AGS-TECH Inc. I-Microelectronics & Semiconductor Manufacturing and Fabrication Amasu ethu amaningi nama-nanomanufacturing, micromanufacturing kanye ne-mesomanufacturing kanye nezinqubo ezichazwe ngaphansi kwamanye amamenyu zingasetshenziselwa MICROELECTRONICS MANUFACTURING_cc781903-5153cde-bbc3b5-58-5cde-bbc-3195-53cde. Kodwa-ke ngenxa yokubaluleka kwe-microelectronics emikhiqizweni yethu, sizogxila esihlokweni esisetshenziswayo salezi zinqubo lapha. Izinqubo ezihlobene nama-Microelectronics nazo zibizwa kabanzi ngokuthi SEMICONDUCTOR FABRICATION processes. Idizayini yethu yobunjiniyela be-semiconductor kanye nezinsizakalo zokwenziwa zifaka: - FPGA ukwakhiwa kwebhodi, ukuthuthukiswa nokuhlela - Microelectronics Foundry amasevisi: Idizayini, prototyping nokukhiqiza, izinsizakalo zezinkampani zangaphandle - Semiconductor isilutshwana sokulungiselela: Ukudayela, ukubuyisela emuva, ukunciphisa, ukubekwa kwe-reticle, ukuhlela ukufa, ukukhetha nokubeka, ukuhlola - Microelectronic ukwakhiwa kwephakheji nokwenziwa: Kokubili ngaphandle kweshalofu nomklamo wangokwezifiso nokwenza - Semiconductor IC umhlangano & ukupakishwa & ukuhlolwa: Die, ngocingo kanye chip bonding, encapsulation, inhlangano, ukumaka kanye uphawu - Ozimele abaholayo bamadivayisi we-semiconductor: Kokubili ukwakheka okungaphandle kweshalofu kanye nokwakheka ngokwezifiso nokwenza - Ukuklama nokwakhiwa kwamasinki okushisa ama-microelectronics: Kokubili ukwakheka okungaphandle kweshalofu kanye nokwakheka ngokwezifiso nokwenza. - Sensor & i-actuator idizayini nokwenziwa: Kokubili ukwakheka okungaphandle kweshalofu kanye nokwakheka ngokwezifiso nokwenza - Optoelectronic & photonic circuits umklamo nokwenza Ake sihlole ukwakhiwa kwe-microelectronics kanye ne-semiconductor kanye nobuchwepheshe bokuhlola kabanzi ukuze uqonde kangcono amasevisi nemikhiqizo esiyinikezayo. I-FPGA Board Design & Development and Programming: Ama-array amasango ahlelekayo (ama-FPGA) angama-silicon chips ahleleleka kabusha. Ngokuphambene namaphrosesa owathola kumakhompuyutha omuntu siqu, ukuhlela i-FPGA kuvuselela i-chip ngokwayo ukuze iqalise ukusebenza komsebenzisi kunokusebenzisa uhlelo lwesofthiwe. Kusetshenziswa amabhulokhi anengqondo akhiwe ngaphambili kanye nezinsiza zomzila ezihlelekayo, ama-chips e-FPGA angacushwa ukuze aqalise ukusebenza kwezingxenyekazi zekhompuyutha zangokwezifiso ngaphandle kokusebenzisa ibhodi lezinkwa nensimbi yokunamathisela. Imisebenzi yekhompyutha yedijithali yenziwa kusofthiwe futhi ihlanganiswe phansi kufayela lokumisa noma i-bitstream equkethe ulwazi lokuthi izingxenye kufanele zixhunywe kanjani ndawonye. Ama-FPGA angasetshenziswa ukwenza noma yimuphi umsebenzi onengqondo i-ASIC engayenza futhi ilungiseka kabusha ngokuphelele futhi inganikezwa “ubuntu” obuhluke ngokuphelele ngokubuyisela ukucushwa kwesekethe okuhlukile. Ama-FPGA ahlanganisa izingxenye ezinhle kakhulu zamasekethe ahlanganisiwe aqondene nohlelo lokusebenza (ama-ASIC) kanye nezinhlelo ezisuselwe kumaphrosesa. Lezi zinzuzo zihlanganisa okulandelayo: • Izikhathi zokuphendula ezisheshayo ze-I/O kanye nokusebenza okukhethekile • Ukweqa amandla ekhompuyutha wama-digital signal processors (DSPs) • Ukwenza i-prototyping ngokushesha nokuqinisekisa ngaphandle kwenqubo yokwenziwa kwe-ASIC yangokwezifiso • Ukuqaliswa kokusebenza ngokwezifiso ngokuthembeka kwehadiwe enqunyiwe ezinikele • Okungathuthukiswa endaweni okuqeda izindleko zokuklama kabusha nokugcinwa kwe-ASIC ngokwezifiso Ama-FPGA ahlinzeka ngesivinini nokuthembeka, ngaphandle kokudinga amanani aphezulu ukuze athethelele izindleko ezinkulu zangaphambili zomklamo we-ASIC wangokwezifiso. I-silicon ehlelwa kabusha iphinde ibe nokuguquguquka okufanayo kwesofthiwe esebenza kumasistimu asekelwe ku-processor, futhi ayinqunyelwe ngenani lama-cores okucubungula atholakalayo. Ngokungafani namaphrosesa, ama-FPGA ayahambisana ngempela ngokwemvelo, ngakho-ke ukucubungula okuhlukile akumele kuqhudelane ngezinsiza ezifanayo. Umsebenzi ngamunye wokucutshungulwa ozimele unikezwa ingxenye ezinikele ye-chip, futhi ingasebenza ngokuzenzakalelayo ngaphandle kwethonya elivela kwamanye amabhulokhi anengqondo. Njengomphumela, ukusebenza kwengxenye eyodwa yohlelo lokusebenza akuthikameki lapho ukucubungula okwengeziwe kwengezwa. Amanye ama-FPGA anezici ze-analog ngaphezu kwemisebenzi yedijithali. Ezinye izici ezivamile ze-analog izinga lokubulala elihlelekayo kanye namandla okushayela kuphinikhodi ngayinye yokukhiphayo, okuvumela unjiniyela ukuthi asethe amanani ahamba kancane kumaphini alayishwe kancane abengase akhale noma amangale ngendlela engamukeleki, futhi asethe amanani aqinile, asheshayo kumaphini alayishwe kakhulu ngesivinini esikhulu. iziteshi ebezizohamba kancane kakhulu. Esinye isici esivamile se-analog iziqhathanisi ezihlukanisayo kumaphinikhodi okufaka aklanyelwe ukuxhunywa eziteshini zokubonisa umehluko. Amanye ama-FPGA wesignali axubile ahlanganise iziguquli ze-analog-to-digital (ADCs) kanye neziguquli zedijithali-kuya-analogi (ama-DAC) anamabhulokhi wokulungisa isignali ye-analogi ezivumela ukuthi zisebenze njengesistimu-on-a-chip. Kafushane, izinzuzo eziphezulu ezi-5 zama-FPGA chips yilezi: 1. Ukusebenza Okuhle 2. Isikhathi Esifushane Sokuya Emakethe 3. Izindleko Eziphansi 4. Ukwethembeka okuphezulu 5. Amandla Okugcina Isikhathi Eside Ukusebenza Okuhle - Ngamandla awo okwamukela ukucubungula okufanayo, ama-FPGA anamandla ekhompuyutha angcono kunama-Digital signal processors (DSPs) futhi awadingi ukubulawa okulandelanayo njengama-DSP futhi angafeza okwengeziwe ngomjikelezo wewashi ngalinye. Ukulawula okokufaka nokuphumayo (I/O) kuleveli yezingxenyekazi zekhompuyutha kunikeza izikhathi zokuphendula ezisheshayo kanye nokusebenza okukhethekile ukuze kufane eduze nezidingo zohlelo lokusebenza. Isikhathi esifushane sokumaketha - ama-FPGA anikeza ukuguquguquka kanye nekhono lokukhiqiza ngokushesha futhi ngaleyo ndlela abe nesikhathi esifushane sokuya emakethe. Amakhasimende ethu angahlola umbono noma umqondo futhi awuqinisekise ku-hardware ngaphandle kokudlula kunqubo ende nebizayo yokwenziwa yomklamo wangokwezifiso we-ASIC. Singasebenzisa izinguquko ezikhulayo futhi siphindaphinde kumklamo we-FPGA phakathi namahora esikhundleni samaviki. Izingxenyekazi zekhompuyutha ezingaphandle kweshalofu zezentengiselwano nazo ziyatholakala ngezinhlobo ezahlukene ze-I/O esezivele zixhunywe ku-chip ye-FPGA ehlelwa umsebenzisi. Ukutholakala okukhulayo kwamathuluzi esoftware yezinga eliphezulu kunikeza ama-IP cores abalulekile (imisebenzi eyakhiwe kusengaphambili) yokulawula okuthuthukile nokucubungula isignali. Izindleko Eziphansi—Izindleko zobunjiniyela ezingabuyeli (NRE) zemiklamo ye-ASIC yangokwezifiso zidlula ezezixazululo zehadiwe ezisekelwe ku-FPGA. Ukutshalwa kwezimali okukhulu kokuqala kuma-ASIC kungathethelelwa ukuthi ama-OEM akhiqize ama-chips amaningi ngonyaka, kodwa abasebenzisi abaningi bokugcina badinga ukusebenza kwehadiwe yangokwezifiso kumasistimu amaningi asathuthuka. I-silicon FPGA yethu ehlelekayo ikunikeza okuthile ngaphandle kwezindleko zokwenziwa noma izikhathi zokuhola ezinde zokuhlanganisa. Izidingo zesistimu zivame ukushintsha ngokuhamba kwesikhathi, futhi izindleko zokwenza izinguquko ezikhulayo kumiklamo ye-FPGA azinakwa uma ziqhathaniswa nezindleko ezinkulu zokuphinda usebenzise i-ASIC. Ukuthembeka Okuphezulu - Amathuluzi esofthiwe ahlinzeka ngendawo yokuhlela futhi ukujikeleza kwe-FPGA kuwukuqaliswa kweqiniso kokwenziwa kohlelo. Amasistimu asekelwe kumaphrosesa ngokuvamile abandakanya izendlalelo eziningi zokungafinyeleli ukusiza ukuhlela umsebenzi nokwabelana ngezinsiza phakathi kwezinqubo eziningi. Isendlalelo somshayeli silawula izinsiza zehadiwe futhi i-OS ilawula inkumbulo kanye nomkhawulokudonsa wephrosesa. Kunoma yimuphi umgogodla wephrosesa onikeziwe, umyalelo owodwa kuphela ongawusebenzisa ngesikhathi, futhi amasistimu asuselwa kuphrosesa ahlala esengozini yemisebenzi ebaluleke kakhulu yesikhathi elandelanayo. Ama-FPGA, awasebenzisi ama-OS, abeka ukukhathazeka kokuthembeka okuncane ngokusebenza kwawo kwangempela okuhambisanayo kanye nezingxenyekazi zekhompuyutha ezinqumayo ezinikezelwe kuwo wonke umsebenzi. Amandla Okugcina Isikhathi Eside - Ama-chips e-FPGA ayathuthukiswa futhi awadingi isikhathi nezindleko ezihilelekile ekuklameni kabusha i-ASIC. Izimiso zokuxhumana zedijithali, isibonelo, zinezincazelo ezingashintsha ngokuhamba kwesikhathi, futhi ukuxhumana okusekelwe ku-ASIC kungase kubangele izinselele zokulondoloza nokuhambisana phambili. Ngokuphambene, ama-FPGA chips angalungiseka kabusha angahambisana nezinguquko ezingase zidingekile zesikhathi esizayo. Njengoba imikhiqizo nezinhlelo zivuthwa, amakhasimende ethu angenza izithuthukisi zokusebenza ngaphandle kokuchitha isikhathi edizayina kabusha izingxenyekazi zekhompuyutha futhi elungisa izakhiwo zebhodi. Izinsizakalo Zokutholwa Kwe-Microelectronics: Izinsizakalo zethu zokusungula i-microelectronics zifaka ukuklama, ukwenza i-prototyping kanye nokukhiqiza, izinsizakalo zezinkampani zangaphandle. Sihlinzeka amakhasimende ethu ngosizo kuwo wonke umjikelezo wokuthuthukiswa komkhiqizo - kusukela ekusekelweni kwedizayini kuye ekwenzeni i-prototyping kanye nokwesekwa kokukhiqiza kwama-semiconductor chips. Inhloso yethu ezinsizeni zosekelo zedizayini ukunika amandla indlela elungile yokuqala ngqa yedizayini yedijithali, ye-analog, kanye nengxubevange yesiginali yamadivayisi we-semiconductor. Isibonelo, amathuluzi okulingisa athile we-MEMS ayatholakala. Izindwangu ezikwazi ukuphatha amawafa angu-6 namayintshi angu-8 we-CMOS ehlanganisiwe ne-MEMS asenkonzweni yakho. Sinikeza amakhasimende ethu ukwesekwa kwedizayini yazo zonke izinkundla ezinkulu ze-electronic design automation (EDA), sihlinzeka ngamamodeli alungile, amakhithi okuklama amaprosesa (i-PDK), imitapo yolwazi ye-analog neyedijithali, nokusekelwa kwedizayini yokukhiqiza (DFM). Sinikeza izinketho ezimbili ze-prototyping zabo bonke ubuchwepheshe: isevisi ye-Multi Product Wafer (MPW), lapho amadivaysi amaningana acutshungulwa ngokuhambisana ku-wafer eyodwa, kanye nesevisi ye-Multi Level Mask (MLM) enamaleveli amamaski amane adwetshwe ku-reticle efanayo. Lezi zonga kakhulu kunesethi yemaski egcwele. Isevisi ye-MLM iguquguquka kakhulu uma iqhathaniswa nezinsuku ezimisiwe zesevisi ye-MPW. Izinkampani zingase zikhethe ukukhipha imikhiqizo ye-semiconductor endaweni yokutholwa kwama-microelectronics ngenxa yezizathu eziningi ezihlanganisa isidingo somthombo wesibili, zisebenzisa izinsiza zangaphakathi zeminye imikhiqizo namasevisi, ukuzimisela ukuhamba ngendlela engelona iqiniso futhi yehlise ubungozi kanye nomthwalo wokusebenzisa indwangu ye-semiconductor...njll. I-AGS-TECH inikeza izinqubo zokwenziwa kwe-open-platform microelectronics ezingancishiswa kuma-wafer run amancane kanye nokukhiqizwa ngobuningi. Ngaphansi kwezimo ezithile, amathuluzi akho akhona e-microelectronics noma okwenziwa kwe-MEMS noma amasethi amathuluzi aphelele angadluliselwa njengamathuluzi athunyelwe noma athengiswe amathuluzi asuka kundwangu yakho aye kusayithi lethu lendwangu, noma imikhiqizo yakho ekhona ye-microelectronics kanye ne-MEMS ingaklanywa kabusha kusetshenziswa ubuchwepheshe benkundla evulekile futhi ithunyelwe ku- inqubo etholakala ku-fab yethu. Lokhu kuyashesha futhi konga kakhulu kunokudlulisa ubuchwepheshe bangokwezifiso. Uma uthanda kodwa izinqubo zokwenziwa zekhasimende ezikhona ze-microelectronics / MEMS zingadluliswa. Ukulungiselela I-Semiconductor Wafer: Uma efunwa amakhasimende ngemva kokuba ama-wafer enziwe ngendwangu encane, senza ukudayela, ukubuyisela emuva, ukuphungula, ukubeka i-reticle, ukuhlela amafa, ukukhetha nokubeka, imisebenzi yokuhlola ku-semiconductor. Ukucutshungulwa kwe-wafer ye-semiconductor kubandakanya i-metrology phakathi kwezinyathelo zokucubungula ezahlukahlukene. Isibonelo, izindlela zokuhlola ifilimu emincane esekelwe ku-ellipsometry noma i-reflectometry, zisetshenziselwa ukulawula ngokuqinile ukushuba kwesango le-oxide, kanye nogqinsi, inkomba ye-refractive kanye ne-coefficient yokuqothula ye-photoresist nezinye izigqoko. Sisebenzisa okokusebenza kokuhlola kwe-wafer ye-semiconductor ukuze siqinisekise ukuthi ama-wafer awalimalanga izinyathelo zangaphambilini zokucubungula kuze kufike ekuhlolweni. Uma izinqubo zangaphambili seziqediwe, amadivaysi e-semiconductor microelectronic angaphansi kokuhlolwa okuhlukahlukene kagesi ukuze kutholwe ukuthi asebenza kahle yini. Sibhekisela engxenyeni yamadivayisi e-microelectronics ku-wafer etholwe isebenza kahle ngokuthi "isivuno". Ukuhlolwa kwama-microelectronics chips ku-wafer kwenziwa ngesihloli se-electronic esicindezela ama-probe amancane ngokumelene ne-semiconductor chip. Umshini ozishintshayo umaka i-microelectronics chip ngayinye embi ngethonsi likadayi. Idatha yokuhlola i-wafer ifakwe kusizindalwazi sekhompuyutha emaphakathi futhi ama-semiconductor chips ahlelwa abe imigqomo ebonakalayo ngokuya ngemikhawulo yokuhlola enqunywe kusengaphambili. Idatha ewumphumela yokubopha ingafakwa kugrafu, noma ifakwe kumephu ye-wafer ukuze kulandelelwe amaphutha okukhiqiza nokumaka ama-chips amabi. Le mephu ingasetshenziswa futhi ngesikhathi sokuhlanganiswa kwe-wafer kanye nokupakishwa. Ekuhlolweni kokugcina, ama-microelectronic chips ayahlolwa futhi ngemva kokupakishwa, ngenxa yokuthi izintambo zebhondi kungenzeka zishoda, noma ukusebenza kwe-analog kungase kushintshwe iphakheji. Ngemuva kokuthi iwafa ye-semiconductor isihloliwe, ivamise ukuncishiswa ngogqinsi ngaphambi kokuthi iwafa ifakwe amaphuzu bese igqekezwa ishone ngayinye. Le nqubo ibizwa ngokuthi i-semiconductor wafer dicing. Sisebenzisa imishini yokukhetha nendawo ezenzakalelayo ekhiqizwe ngokukhethekile imboni ye-microelectronics ukuze silungise ukufa kwe-semiconductor okuhle nokubi. Ama-chips we-semiconductor amahle kuphela, ahlanganisiwe. Okulandelayo, kupulasitiki ye-microelectronics noma inqubo yokupakisha ye-ceramic sikhweza i-semiconductor die, sixhume amaphedi okufa kumaphini ephaketheni, bese sivala idayizi. Izintambo zegolide ezincane zisetshenziselwa ukuxhuma amaphedi nezikhonkwane kusetshenziswa imishini ezenzakalelayo. I-Chip scale package (CSP) ingobunye ubuchwepheshe bokupakisha be-microelectronics. Iphakethe lepulasitiki elikabili emgqeni (i-DIP), njengamaphakheji amaningi, likhulu ngokuphindwe kaningi kunefa le-semiconductor langempela elifakwe ngaphakathi, kanti ama-CSP chips acishe alingane nama-microelectronics afayo; futhi i-CSP ingakhiwa endaweni ngayinye ngaphambi kokuthi iwafa ye-semiconductor idayiwe. Ama-microelectronic chips apakishiwe aphinde ahlolwe ukuze kuqinisekiswe ukuthi awonakele ngesikhathi sokupakishwa nokuthi inqubo yokuxhumanisa i-die-to-pin iqedwe ngendlela efanele. Sisebenzisa ama-lasers siqopha amagama nezinombolo ze-chip ephaketheni. I-Microelectronic Package Design and Fabrication: Sinikeza kokubili i-off-shelf kanye nomklamo wangokwezifiso kanye nokwakhiwa kwamaphakheji we-microelectronic. Njengengxenye yale sevisi, ukumodela kanye nokulingiswa kwamaphakheji we-microelectronic nakho kwenziwa. Ukumodela nokulingisa kuqinisekisa i-virtual Design of Experiments (DoE) ukuze kuzuzwe isisombululo esifanele, kunokuhlola amaphakheji enkundleni. Lokhu kunciphisa izindleko nesikhathi sokukhiqiza, ikakhulukazi ukuthuthukiswa komkhiqizo omusha kuma-microelectronics. Lo msebenzi futhi usinika ithuba lokuchaza amakhasimende ethu ukuthi ukuhlanganisa, ukwethembeka nokuhlola kuzoba nomthelela kanjani emikhiqizweni yawo ye-microelectronic. Inhloso eyinhloko yokupakishwa kwe-microelectronic iwukuklama isistimu ye-elekthronikhi ezokwanelisa izimfuneko zohlelo oluthile ngezindleko ezifanele. Ngenxa yezinketho eziningi ezitholakalayo zokuxhuma nokufaka isistimu ye-microelectronics, ukukhetha kobuchwepheshe bokupakisha kuhlelo olunikeziwe kudinga ukuhlolwa kochwepheshe. Imibandela yokukhetha yamaphakeji e-microelectronics ingase ihlanganise okunye kokushayela kobuchwepheshe okulandelayo: -Ukusebenziseka kalula -Veza -Izindleko -Izakhiwo zokukhipha ukushisa -Ukusebenza kwe-electromagnetic shielding -Ukuqina komshini -Ukwethembeka Lokhu kucatshangelwa kwedizayini yamaphakheji we-microelectronics kuthinta isivinini, ukusebenza, amazinga okushisa okuhlangana, ivolumu, isisindo nokunye. Umgomo oyinhloko ukukhetha ubuchwepheshe bokuxhumanisa obungabizi kakhulu kodwa obuthembekile. Sisebenzisa izindlela zokuhlaziya eziyinkimbinkimbi nesofthiwe ukuze sidizayine amaphakheji e-microelectronics. Ukupakishwa kwe-Microelectronics kuphathelene nokuklanywa kwezindlela zokwenziwa kwamasistimu amancane kagesi axhumene kanye nokuthembeka kwalawo masistimu. Ngokukhethekile, ukupakishwa kwama-microelectronics kuhlanganisa umzila wamasignali ngenkathi kugcinwa ubuqotho besignali, ukusabalalisa umhlabathi namandla kumasekethe ahlanganisiwe we-semiconductor, ukusabalalisa ukushisa okuhlakaziwe ngenkathi kugcinwa ubuqotho besakhiwo kanye nempahla, nokuvikela isifunda ezingozini zemvelo. Ngokuvamile, izindlela zokupakisha ama-microelectronics IC zifaka ukusetshenziswa kwe-PWB enezixhumi ezihlinzeka ngama-I/O omhlaba wangempela kusekethe kagesi. Izindlela zokupakisha zendabuko ze-microelectronics zibandakanya ukusetshenziswa kwephakheji elilodwa. Inzuzo eyinhloko yephakheji ye-chip eyodwa yikhono lokuhlola ngokugcwele i-microelectronics IC ngaphambi kokuyixhuma ku-substrate engaphansi. Amadivayisi anjalo apakishiwe e-semiconductor afakwe ngembobo noma abekwe phezulu ku-PWB. Amaphakheji e-microelectronics afakwe phezulu awadingi ukuthi adlule ngezimbobo ebhodini lonke. Esikhundleni salokho, izingxenye zama-microelectronics abekwe phezulu zingadayiswa kuzo zombili izinhlangothi ze-PWB, okuvumela ukuminyana kwesekethe okuphezulu. Le ndlela ibizwa ngokuthi i-surface-mount technology (SMT). Ukwengezwa kwamaphakheji esitayela sendawo efana ne-ball-grid arrays (BGAs) kanye namaphakheji esikali se-chip (CSPs) kwenza i-SMT iqhudelane nobuchwepheshe bokupakisha be-semiconductor microelectronics obuphezulu kakhulu. Ubuchwepheshe obusha bokupakisha bubandakanya ukunamathiselwa kwedivayisi ye-semiconductor engaphezu kweyodwa ku-substrate exhumanisayo ephezulu, ebese ifakwa kuphakheji enkulu, ehlinzeka kokubili izikhonkwane ze-I/O nokuvikelwa kwemvelo. Lobu buchwepheshe bemojula ye-multichip (MCM) bubonakala futhi ngobuchwepheshe be-substrate obusetshenziswa ukuxhuma ama-IC anamathiselwe. I-MCM-D imele ifilimu elincanyana elifakwe insimbi kanye nama-dielectric multilayers. Ama-substrates e-MCM-D anokuminyana kwezintambo okuphezulu kakhulu kwabo bonke ubuchwepheshe be-MCM ngenxa yobuchwepheshe obuyindida bokucubungula i-semiconductor. I-MCM-C ibhekisela kuma-substrates "oceramic" anezendlalelo eziningi, axoshwe ezendlaleloni ezishintshanayo zoyinki wensimbi abahloliwe kanye namashidi e-ceramic angashiswanga. Ngokusebenzisa i-MCM-C sithola umthamo wezintambo eziminyene ngokumaphakathi. I-MCM-L ibhekisela kuma-substrates ezendlalelo eziningi enziwe “ngamalayini” e-PWB estakiwe, enziwe ngensimbi, anephethini ngayinye bese enziwe laminated. Bekukade kuwubuchwepheshe bokuxhumanisa obunokuminyana okuphansi, nokho manje i-MCM-L isondela ngokushesha ekuminyaneni kobuchwepheshe bokupakisha be-MCM-C kanye ne-MCM-D microelectronics. I-Direct chip attach (DCA) noma ubuchwepheshe bokupakisha be-chip-on-board (COB) microelectronics buhlanganisa ukukhweza ama-microelectronics ICs ngqo ku-PWB. I-encapsulant yepulasitiki, "egubungele" phezu kwe-IC engenalutho bese yelapheka, inikeza ukuvikelwa kwemvelo. I-Microelectronics ICs ingaxhunywa ku-substrate kusetshenziswa i-flip-chip, noma izindlela zokubopha izintambo. Ubuchwepheshe be-DCA bonga kakhulu kumasistimu akhawulelwe kuma-IC we-semiconductor angu-10 noma ngaphansi, njengoba izinombolo ezinkulu zama-chips zingathinta ukukhiqizwa kwesistimu futhi ukuhlanganisa kwe-DCA kungase kube nzima ukuphinda kusebenze. Inzuzo evamile kuzo zombili izinketho zokupakisha ze-DCA ne-MCM ukuqedwa kwezinga lokuxhuma lephakeji ye-IC semiconductor, okuvumela ukusondelana (ukubambezeleka kokudlulisa isignali okufushane) kanye nokuncishiswa kokungena komthofu. Ububi obuyinhloko ngazo zombili izindlela ubunzima bokuthenga ama-IC ahlolwe ngokugcwele ama-microelectronics. Okunye okubi kobuchwepheshe be-DCA kanye ne-MCM-L kufaka phakathi ukuphathwa okushisayo kokushisa okuphansi ngenxa yokungabi khona kokusebenza okushisayo kwama-laminates e-PWB kanye ne-coefficient empofu yomdlalo wokunwebeka oshisayo phakathi kwe-semiconductor die kanye ne-substrate. Ukuxazulula inkinga yokungezwani kokwanda okushisayo kudinga i-interposer substrate efana ne-molybdenum ye-wire bonded die kanye ne-epoxy engagcwali ye-flip-chip die. I-multichip carrier module (MCCM) ihlanganisa zonke izici ezinhle ze-DCA nobuchwepheshe be-MCM. I-MCCM imane iyi-MCM encane esiphathini sensimbi esincanyana esingaboshelwa noma sinamathiselwe ngomshini ku-PWB. Iphansi lensimbi lisebenza njengento ekhipha ukushisa kanye ne-interposer yengcindezi ye-MCM substrate. I-MCCM inomkhondo ojikelezayo wokubopha intambo, ukusoda, noma ukubopha ithebhu ku-PWB. Ama-IC we-semiconductor avikelekile avikelwe kusetshenziswa i-glob-top material. Uma usithinta, sizoxoxa ngesicelo sakho kanye nezidingo zokukukhethela inketho yokupakisha ye-microelectronics engcono kakhulu. I-Semiconductor IC Assembly & Packaging & Test: Njengengxenye yezinsizakalo zethu zokwenziwa kwe-microelectronics sinikeza i-die, intambo ne-chip bonding, i-encapsulation, ukuhlanganisa, ukumaka nokufaka uphawu, ukuhlola. Ukuze i-chip ye-semiconductor noma isekethe ye-microelectronics ehlanganisiwe isebenze, idinga ukuxhunywa kusistimu ezoyilawula noma inikeze imiyalelo kuyo. I-Microelectronics IC assembly ihlinzeka ngoxhumano lwamandla nolwazi lokudlulisa phakathi kwe-chip nohlelo. Lokhu kufezwa ngokuxhuma i-chip ye-microelectronics kuphakheji noma ukuyixhuma ngokuqondile ku-PCB yale misebenzi. Ukuxhumana phakathi kwe-chip nephakheji noma ibhodi lesekethe eliphrintiwe (PCB) kwenziwa nge-wire bonding, i-thru-hole noma i-flip chip assembly. Singumholi wemboni ekutholeni izixazululo zokupakisha ze-microelectronics IC ukuze sihlangabezane nezidingo eziyinkimbinkimbi zezimakethe ezingenantambo neze-inthanethi. Sinikeza izinkulungwane zamafomethi wephakheji nosayizi abahlukene, kusukela kumaphakheji we-IC we-leadframe microelectronics ye-thru-hole ne-surface mount, kuya ku-chip scale yakamuva (CSP) kanye nezixazululo ze-ball grid array (BGA) ezidingekayo ekubalweni kwamaphinikhodi aphezulu kanye nezinhlelo zokusebenza zokuminyana okuphezulu. . Amaphakheji anhlobonhlobo ayatholakala esitokweni ahlanganisa i-CABGA (Chip Array BGA), CQFP, CTBGA (Chip Array Thin Core BGA), CVBGA (Very Thin Chip Array BGA), Flip Chip, LCC, LGA, MQFP, PBGA, PDIP, I-PLCC, i-PoP - Iphakheji Kuphakheji, i-PoP TMV - Ngesikhunta Via, SOIC / SOJ, SSOP, TQFP, TSOP, WLP (Iphakheji Yezinga Le-Wafer)…..etc. Ukubopha ngocingo kusetshenziswa ithusi, isiliva noma igolide kuphakathi kwezinto ezidumile kuma-microelectronics. Intambo yethusi (Cu) ibiyindlela yokuxhuma i-silicon semiconductor ifa kumatheminali ephakheji ye-microelectronics. Ngokukhuphuka kwakamuva kwezindleko zezintambo zegolide (Au), intambo yethusi (Cu) iyindlela ekhangayo yokuphatha izindleko zephakheji ku-microelectronics. Iphinde ifane nocingo lwegolide (Au) ngenxa yezakhiwo zayo zikagesi ezifanayo. I-self-inductance ne-self capacitance icishe ifane ngentambo yegolide (Au) neyethusi (Cu) enentambo yethusi (Cu) enokumelana okuphansi. Kuzinhlelo zokusebenza ze-microelectronics lapho ukumelana ngenxa yentambo yebhondi kungase kube nomthelela omubi ekusebenzeni kwesekethe, kusetshenziswa intambo yethusi (Cu) inganikeza ukuthuthuka. Izintambo zengxubevange yethusi, iPalladium Coated Copper (PCC) kanye neSilver (Ag) sezivele njengezinye izindlela kunezintambo zegolide zamabhondi ngenxa yezindleko. Izintambo ezenziwe ngethusi azibizi futhi zine-resistivity kagesi ephansi. Kodwa-ke, ukuqina kwethusi kwenza kube nzima ukusebenzisa izinhlelo eziningi ezifana nalezo ezinezakhiwo ezibuthakathaka zebhondi. Kulezi zinhlelo zokusebenza, i-Ag-Alloy inikezela ngezakhiwo ezifanayo nalezo zegolide kuyilapho izindleko zayo zifana nalezo ze-PCC. Intambo ye-Ag-Alloy ithambile kune-PCC okuholela emazingeni aphansi e-Al-Splash kanye nengozi ephansi yokulimala kwephedi yebhondi. I-Ag-Alloy wire iwukushintsha okungcono kakhulu kwezindleko eziphansi zezinhlelo zokusebenza ezidinga i-die-to-die bonding, i-waterfall bonding, i-ultra-fine bond pad pitch kanye nokuvuleka kwephedi yebhondi encane, ukuphakama kwelophu ephansi kakhulu. Sihlinzeka ngohlu oluphelele lwezinsizakalo zokuhlola i-semiconductor okuhlanganisa ukuhlolwa kwe-wafer, izinhlobo ezahlukene zokuhlola kokugcina, ukuhlolwa kwezinga lesistimu, ukuhlolwa kwemichilo kanye nezinsizakalo eziphelele zokuphela komugqa. Sihlola izinhlobo ezahlukene zedivayisi ye-semiconductor kuyo yonke imindeni yethu yamaphakeji okuhlanganisa imvamisa yomsakazo, i-analog nesiginali exubile, idijithali, ukuphathwa kwamandla, inkumbulo nezinhlanganisela ezihlukahlukene ezifana ne-ASIC, amamojula e-multi chip, i-System-in-Package (SiP), kanye ukupakishwa kwe-3D estakiwe, izinzwa namadivayisi we-MEMS afana nama-accelerometer nezinzwa zokucindezela. I-Hardware yethu yokuhlola kanye nemishini yokuxhumana ifanele usayizi wephakheji wangokwezifiso i-SiP, izixazululo zokuxhumana ezikabili zePhakheji kuPhakheji (i-PoP), i-TMV PoP, amasokhethi e-FusionQuad, i-MicroLeadFrame enemigqa eminingi, I-Fine-Pitch Copper Pillar. Imishini yokuhlola nezitezi zokuhlola kuhlanganiswe namathuluzi e-CIM/CAM, ukuhlaziya isivuno nokuqapha ukusebenza ukuze kulethe isivuno esihle kakhulu okokuqala ngqa. Sinikezela ngezinqubo eziningi zokuhlola i-microelectronics kumakhasimende ethu futhi sinikezela ngokugeleza kokuhlola okusabalalisiwe kwe-SiP nokunye ukugeleza komhlangano oyinkimbinkimbi. I-AGS-TECH ihlinzeka ngobubanzi obugcwele bokubonisana, ukuthuthukiswa kanye nezinsizakalo zobunjiniyela kuwo wonke umjikelezo wakho wokuphila womkhiqizo we-semiconductor kanye ne-microelectronics. Siyaziqonda izimakethe ezihlukile kanye nezidingo zokuhlola ze-SiP, izimoto, inethiwekhi, amageyimu, ihluzo, ikhompuyutha, i-RF / wireless. Izinqubo zokukhiqiza ama-semiconductor zidinga izixazululo zokumaka ezisheshayo nezilawulwa ngokunembile. Izivinini zokumaka ezingaphezu kwezinhlamvu eziyi-1000/ngesekhondi kanye nokujula kokungena kokubalulekile okungaphansi kwama-microns angu-25 kuvamile embonini ye-semiconductor microelectronics kusetshenziswa ama-laser athuthukile. Siyakwazi ukumaka izinhlanganisela zesikhunta, amawafa, izitsha zobumba nokunye okuningi ngokufakwa kokushisa okuncane nokuphindaphinda kahle. Sisebenzisa ama-laser ngokunemba okuphezulu ukumaka ngisho nezingxenye ezincane ngaphandle kokulimala. Amafreyimu aholayo Amadivayisi e-Semiconductor: Kokubili i-off-shelf kanye nedizayini yangokwezifiso nokwenziwa kuyenzeka. Amafreyimu omthofu asetshenziswa ezinqubweni zokuhlanganisa idivayisi ye-semiconductor, futhi empeleni ayizendlalelo ezincane zensimbi ezixhuma izintambo ezisuka kumatheminali amancane kagesi endaweni ye-semiconductor microelectronics kuya kumjikelezo omkhulu kumadivayisi kagesi nama-PCB. Amafreyimu omthofu asetshenziswa cishe kuwo wonke amaphakheji we-semiconductor microelectronics. Amaphakheji amaningi e-IC ye-microelectronics enziwa ngokubeka i-silicon chip ye-semiconductor ohlakeni oluholayo, bese kuba intambo ebopha i-chip emithonjeni yensimbi yalolo hlaka lomthofu, bese imboza chip ye-microelectronics ngekhava yepulasitiki. Le phakheji elula futhi ephansi kakhulu ye-microelectronics iseyisixazululo esingcono kakhulu sezinhlelo zokusebenza eziningi. Amafreyimu omthofu akhiqizwa ngamapheshana amade, okuwavumela ukuthi acutshungulwe ngokushesha emishinini yokuhlanganisa ezenzakalelayo, futhi ngokuvamile kusetshenziswa izinqubo ezimbili zokukhiqiza: ukufakwa kwezithombe kohlobo oluthile nokugxiviza. Ku-microelectronics idizayini yohlaka oluholayo ngokuvamile idinga ukucaciswa nezici ezingokwezifiso, imiklamo ethuthukisa izakhiwo zikagesi nezishisayo, kanye nezidingo zesikhathi somjikelezo othile. Sinolwazi olujulile lokwenziwa kohlaka oluholayo lwe-microelectronics lwamakhasimende amaningi ahlukene asebenzisa ukushumeka izithombe nokugxivizwa nge-laser. Idizayini nokwenziwa kwamasinki okushisa ama-microelectronics: Kokubili ngaphandle kweshalofu kanye nokwakheka ngokwezifiso nokwenza. Ngokukhula kokukhishwa kokushisa okuvela kumadivayisi e-microelectronics kanye nokuncipha kwezici zefomu jikelele, ukuphathwa kwe-thermal kuba into ebaluleke kakhulu yokwakhiwa komkhiqizo we-elekthronikhi. Ukungaguquguquki ekusebenzeni kanye neminyaka yokuphila kwemishini kagesi kuhlobene ngokuphambene nezinga lokushisa lengxenye yezinto zokusebenza. Ubudlelwano phakathi kokuthembeka nezinga lokushisa lokusebenza kwedivayisi evamile ye-silicon semiconductor libonisa ukuthi ukuncipha kwezinga lokushisa kuhambisana nokwenyuka komchazi kokuthembeka neminyaka yokuphila kwedivayisi. Ngakho-ke, impilo ende nokusebenza okuthembekile kwengxenye ye-semiconductor microelectronics kungase kuzuzwe ngokulawula ngempumelelo izinga lokushisa ledivayisi ngaphakathi kwemikhawulo ebekwe abaklami. Osinki bokushisa bangamadivayisi athuthukisa ukunqanyulwa kokushisa endaweni eshisayo, ngokuvamile ikesi yangaphandle yengxenye ekhiqiza ukushisa, ukuya endaweni epholile efana nomoya. Ezingxoxweni ezilandelayo, umoya uthathwa njengoketshezi olupholisayo. Ezimweni eziningi, ukudluliswa kokushisa kuyo yonke indawo phakathi kwendawo eqinile nomoya opholile kungasebenzi kahle kakhulu ngaphakathi kwesistimu, futhi isixhumi esibonakalayo somoya oqinile simelela umgoqo omkhulu kakhulu wokukhipha ukushisa. Isitha sokushisa sehlisa lesi sivimbelo ngokuyinhloko ngokukhulisa indawo engaphezulu ethintana ngqo nesipholile. Lokhu kuvumela ukushisa okwengeziwe ukuthi kuhlakazwe futhi/noma kwehlise izinga lokushisa lokusebenza kwedivayisi ye-semiconductor. Injongo eyinhloko yosinki wokushisa iwukugcina izinga lokushisa ledivayisi ye-microelectronics lingaphansi kwezinga eliphezulu lokushisa elivumelekile elicaciswe umkhiqizi wedivayisi ye-semiconductor. Singakwazi ukuhlukanisa amasinki okushisa ngokwezindlela zokukhiqiza kanye nokuma kwawo. Izinhlobo ezivame kakhulu zamasinki okushisa apholile zifaka: - Izitembu: Izinsimbi ze-Copper noma i-aluminium zigxivizwa zibe yizimo ezifunwayo. zisetshenziswa ekupholiseni komoya kwendabuko kwezingxenye ze-elekthronikhi futhi zinikeza isixazululo esinomnotho ezinkingeni ezishisayo zokuminyana okuphansi. Zifanele ukukhiqizwa kwevolumu ephezulu. - I-Extrusion: Lawa masinki okushisa avumela ukwakheka komumo obanzi onezinhlangothi ezimbili okwazi ukuqeda imithwalo yokushisa emikhulu. Angase asikwe, enziwe ngomshini, futhi angezwe izinketho. I-cross-cutting izokhiqiza amasinki okushisa e-omnidirectional, amaphinikhodi angama-rectangular, futhi okuhlanganisa amaphiko amisekile kuthuthukisa ukusebenza cishe ngo-10 ukuya ku-20%, kodwa ngesilinganiso esinensayo sokukhipha. Imikhawulo ye-Extrusion, efana nogqinsi lwe-fin height-to-gap fin, ngokuvamile ilawula ukuguquguquka kwezinketho zedizayini. Isici esijwayelekile se-fin height-to-gap esifinyelela ku-6 kanye nobuncane be-fin ukujiya obungu-1.3mm, singafinyeleleka ngamasu ajwayelekile okukhipha. I-aspect ratio engu-10 kuye ku-1 kanye nogqinsi luka-0.8″ lungatholwa ngezici ezikhethekile zedizayini ye-die. Kodwa-ke, njengoba i-aspect ratio ikhula, ukubekezelelana kwe-extrusion kuba sengozini. - Izinqamuleli Ezihlanganisiwe/Ezakhiwe: Amasinki amaningi okushisa apholile anomkhawulo wokuguquguquka, futhi ukusebenza okushisayo kukonke kwesinki wokushisa opholile kungase kuthuthukiswe kakhulu uma indawo engaphezulu ingavezwa emoyeni. Lawa masinki okushisa asebenza kahle asebenzisa i-epoxy egcwele i-aluminium esebenza ngokufudumeza ukuhlanganisa amaphiko epulaneti epuleti lesisekelo se-extrusion eligobile. Le nqubo ivumela isilinganiso esikhulu kakhulu se-fin height-to-gap sika-20 kuya ku-40, okwandisa kakhulu umthamo wokupholisa ngaphandle kokwandisa isidingo sevolumu. - Ukusakaza: Isihlabathi, i-wax elahlekile kanye nezinqubo zokuphonsa ze-aluminium noma zethusi / zethusi ziyatholakala ngosizo lwe-vacuum noma ngaphandle. Sisebenzisa lobu buchwepheshe ekwenzeni amasinki okushisa amaphinikhodi aqinile ahlinzeka ngokusebenza okuphezulu uma kusetshenziswa ukupholisa kwe-impingement. - Izinhlamvu ezigoqiwe: Ishidi likathayela lensimbi elivela ku-aluminium noma ithusi linyusa indawo engaphezulu kanye nokusebenza kwevolumu. Usinki wokushisa ube usunamathiselwa ku-base plate noma ngokuqondile endaweni yokushisisa nge-epoxy noma i-brazing. Ayiwafanele amasinki okushisa ephrofayili ephezulu ngenxa yokutholakala nokusebenza kahle kwe-fin. Ngakho-ke, ivumela amasinki okushisa asebenza kahle ukuthi enziwe. Ekukhetheni isinki sokushisa esifanelekile esihlangabezana nemibandela yokushisa edingekayo yezinhlelo zakho zokusebenza ze-microelectronics, sidinga ukuhlola amapharamitha ahlukahlukene angathinti kuphela ukusebenza kweziko lokushisa ngokwalo, kodwa nokusebenza kwesistimu kukonke. Ukukhethwa kohlobo oluthile losinki wokushisa kuma-microelectronic kuncike kakhulu kusabelomali esishisayo esivunyelwe kusinki sokushisa nezimo zangaphandle ezizungeze usinki wokushisa. Alikho inani elilodwa lokumelana nokushisa elinikezwe kusinki okushisa esinikeziwe, njengoba ukumelana nokushisa kuyahlukahluka nezimo zokupholisa zangaphandle. I-Sensor & Actuator Design and Fabrication: Kokubili i-off-shelf kanye nomklamo wangokwezifiso nokwenziwa kuyatholakala. Sinikeza izixazululo ezinezinqubo ezilungele ukusetshenziswa zezinzwa ze-inertial, izinzwa zengcindezi nezihlobene kanye namadivayisi enzwa ye-IR. Ngokusebenzisa amabhlogo ethu e-IP ama-accelerometer, i-IR nezinzwa zokucindezela noma ukusebenzisa idizayini yakho ngokuvumelana nezicaciso ezitholakalayo nemithetho yokuklama, singalethwa izinzwa ezisekelwe ku-MEMS zilethwe kuwe phakathi namaviki. Ngaphandle kwe-MEMS, ezinye izinhlobo zenzwa kanye nezinhlaka ze-actuator zingakhiwa. Idizayini nokwakhiwa kwamasekhethi e-Optoelectronic & photonic: Isekethe ehlanganisiwe yesithombe noma i-optical (PIC) iyidivayisi ehlanganisa imisebenzi eminingi yezithombe. Ingase ifane namasekethe ahlanganisiwe we-elekthronikhi kuma-microelectronics. Umehluko omkhulu phakathi kwalokhu okubili ukuthi isifunda esihlanganisiwe se-photonic sinikeza ukusebenza kwamasignali olwazi abekwe kumaza wamaza okukhanya ku-spectrum ebonakalayo noma eduze kwe-infrared 850 nm-1650 nm. Amasu okwakha ayafana nalawo asetshenziswa kumasekhethi ahlanganisiwe e-microelectronics lapho i-photolithography isetshenziselwa ukwenza iphethini yamawafa okunamathisela kanye nokubeka izinto ezibonakalayo. Ngokungafani ne-semiconductor microelectronics lapho idivayisi eyinhloko kuyi-transistor, alikho idivayisi eyodwa elawulayo ku-optoelectronics. Ama-Photonic chips afaka phakathi ama-waveguide e-interconnect okulahlekelwa okuphansi, izihlukanisi zamandla, izikhulisa-zwi ezibonakalayo, ama-optical modulators, izihlungi, ama-lasers kanye nezitholi. Lawa madivaysi adinga izinhlobonhlobo zezinto ezihlukene kanye namasu okwenza izinto ngakho-ke kunzima ukuzibona zonke ku-chip eyodwa. Izicelo zethu zamasekethe ahlanganisiwe ezithombe ikakhulukazi zisezindaweni zokuxhumana nge-fiber-optic, biomedical kanye ne-photonic computing. Ezinye zezibonelo zemikhiqizo ye-optoelectronic esingakuklama futhi sikwakhele yona ama-LED (I-Light Emitting Diode), amalaser e-diode, izamukeli ze-optoelectronic, ama-photodiode, amamojula webanga le-laser, amamojula e-laser enziwe ngokwezifiso nokunye. CLICK Product Finder-Locator Service IKHASI ELIDLULE

Industrial & Specialty & Functional Textiles, Hydrophobic - Hydrophillic Textile Materials, Flame Resistant Textiles, Antibasterial, Antifungal, Antistatic, UC Protective Fabrics, Filtering Clothes, Textiles for Surgery, Biocompatible Fabric I-Industrial & Specialty & Functional Textiles Okusithakaselayo yizindwangu ezikhethekile nezisebenzayo kuphela nezindwangu nemikhiqizo eyenziwe ngakho esebenzela uhlelo oluthile. Lezi yizindwangu zobunjiniyela zenani elivelele, ngezinye izikhathi ezibizwa ngokuthi izindwangu zobuchwepheshe nezindwangu. Izindwangu ezilukiwe kanye nezingezona ezilukiwe nezindwangu ziyatholakala ezinhlelweni eziningi. Ngezansi kunohlu lwezinhlobo ezithile ezinkulu zezindwangu zezimboni nezikhethekile nezisebenzayo ezingaphakathi kokuthuthukiswa komkhiqizo wethu kanye nomkhakha wokukhiqiza. Sizimisele ukusebenzisana nawe ekuklameni, ekuthuthukiseni nasekukhiqizeni imikhiqizo yakho eyenziwe ngalezi: I-Hydrophobic (i-repellant yamanzi) kanye ne-hydrophilic (emunca amanzi) izinto zendwangu Izindwangu nezindwangu ezinamandla angavamile, ukuqina kanye nokumelana nezimo ezinzima zemvelo (ezifana nezinhlamvu, ukumelana nokushisa okuphezulu, ukumelana nokushisa okuphansi, ukumelana nelangabi, okungenayo noma ukumelana noketshezi olubolayo kanye namagesi, formation….) I-Antibacterial & Antifungal textiles nezindwangu Isivikelo se-UV Izindwangu nezindwangu ezisebenza ngogesi nezingaconductive Izindwangu ze-Antistatic zokulawula i-ESD….etc. Izindwangu nezindwangu ezinezakhiwo ezikhethekile nemiphumela (i-fluorescent... njll.) Izindwangu, izindwangu nezindwangu ezinekhono elikhethekile lokuhlunga, ukukhiqizwa kokuhlunga Izindwangu zezimboni ezifana nezindwangu zamapayipi, ama-interlining, ukuqinisa, amabhande okudlulisela, iziqinisekiso zenjoloba (amabhande okuthutha, izingubo zokulala, izintambo), izindwangu zamateyipu kanye nama-abrasives. Izindwangu zemboni yezimoto (amapayipi, amabhande, ama-airbag, ama-interlinings, amathayi) Izindwangu zokwakha, ukwakha kanye nemikhiqizo yengqalasizinda (indwangu kakhonkolo, ama-geomembranes, kanye ne-innerduct yendwangu) Izindwangu ezihlanganisiwe ezinemisebenzi eminingi enezendlalelo ezihlukene noma izingxenye zemisebenzi eyahlukene. Izindwangu ezenziwe nge-activated carbon infusion on polyester fibers ukunikeza umuzwa wesandla sikakotini, ukukhululwa kwephunga, ukuphathwa komswakama kanye ne-UV. Izindwangu ezenziwe ngama-polymer enkumbulo yomumo Izindwangu zokuhlinzwa kanye nezimila zokuhlinzwa, izindwangu ze-biocompatible Sicela uqaphele ukuthi sinonjiniyela, siklama futhi sikhiqiza imikhiqizo ngokwezidingo zakho kanye nezincazelo zakho. Singakwazi ukukhiqiza imikhiqizo ngokusho kwakho noma, Uma uthanda, singakusiza ekukhetheni izinto ezifanele kanye nokuklama umkhiqizo. IKHASI ELIDLULE

Camera Systems - Components - Optic Scanner - Optical Readers - Imaging System - CCD - Optomechanical Systems - IR Cameras Ukwenziwa Kwezinhlelo Zekhamera Engokwezifiso Nokuhlanganiswa I-AGS-TECH inikeza: • Amasistimu ekhamera, izingxenye zekhamera kanye nemihlangano yekhamera yangokwezifiso • Izikena zokubona eziklanywe ngokwezifiso, izifundi, inhlanganisela yomkhiqizo wokuphepha obonakalayo. • Ukunemba okunembile, i-opto-mechanical kanye ne-electro-optical assemblies ehlanganisa i-imaging ne-nonimaging optics, ukukhanya kwe-LED, i-fiber optics namakhamera e-CCD • Phakathi kwemikhiqizo eyenziwe onjiniyela bethu be-optical: - I-Omni-directional periscope kanye nekhamera yezinhlelo zokusebenza zokugada nezokuphepha. 360 x 60º inkambu yokubuka isithombe sokucaca okuphezulu, akukho ukuthungwa okudingekayo. - Ikhamera yevidiyo ye-engeli ebanzi yangaphakathi - Super slim 0.6 mm ububanzi be-endoscope yevidiyo eguqukayo. Wonke ama-couplers evidiyo ezokwelapha alingana ngaphezu kweziqeshana zamehlo ezijwayelekile ze-endoscope futhi avalwe ngokuphelele futhi ayacwiliswa. Ukuze uthole i-endoscope yethu yezokwelapha nezinhlelo zamakhamera, sicela uvakashele: http://www.agsmedical.com - Ikhamera yevidiyo kanye ne-coupler ye-endoscope eqinile - I-Eye-Q Videoprobe. I-zoom videoprobe yokungaxhumani nemishini yokulinganisa. - I-Optical spectrograph & ne-IR imaging system (OSIRIS) yesathelayithi ye-ODIN. Onjiniyela bethu basebenze ekuhlanganiseni iyunithi yendiza, ukuqondanisa, ukuhlanganisa nokuhlola. - I-interferometer ye-Wind imaging (WINDII) ye-NASA yocwaningo lwesathelayithi yokucwaninga emkhathini (UARS). Onjiniyela bethu basebenze ngokubonisana ekuhlanganiseni, ekuhlanganiseni nasekuhlolweni. Ukusebenza kwe-WINDII nesikhathi sokuphila sokusebenza kudlule kude imigomo nezidingo zokuklama. Ngokuya ngohlelo lwakho lokusebenza, sizonquma ukuthi ingakanani ubukhulu, isibalo samaphikseli, ukulungiswa, ukuzwela kwe-wavelength okudingwa uhlelo lwakho lwekhamera. Singakwakhela amasistimu afanele i-infrared, ebonakalayo namanye amaza wamaza. Xhumana nathi namuhla ukuze uthole okwengeziwe. Dawuniloda incwajana yethu KALA UHLELO LOKUBAMBISANA Futhi qiniseka ukuthi ulanda ikhathalogi yethu ephelele yezingxenye zikagesi neze-elekthronikhi ngemikhiqizo engekho eshalofini NGOKUCHOFOZA LAPHA. CLICK Product Finder-Locator Service IKHASI ELIDLULE

Micro-Optics, Micro-Optical, Microoptical, Wafer Level Optics, Gratings, Fresnel Lenses, Lens Array, Micromirrors, Micro Reflectors, Collimators, Aspheres, LED Ukukhiqiza I-Micro-Optics Enye yezinkambu ku-microfabrication esibandakanyeka kuyo is MICRO-OPTICS MANUFACTURING. I-Micro-optics ivumela ukukhohliswa kokukhanya kanye nokuphathwa kwama-photons nge-micron kanye ne-sub-micron scale scale structures and components. Ezinye izinhlelo zokusebenza ze MICRO-OPTICAL COMPONENTS kanye ne-SUBSYSTEMS are: Ubuchwepheshe bolwazi: Kuma-micro-display, ama-micro-projectors, isitoreji sedatha yokubona, amakhamera amancane, izikena, amaphrinta, amakhophi...njll. I-Biomedicine: Ukuxilongwa okuncane kokuhlasela/iphuzu lokunakekelwa, ukuqapha ukwelashwa, izinzwa ze-micro-imaging, izimila ze-retina, ama-micro-endoscopes. Ukukhanyisa: Amasistimu asekelwe kuma-LED neminye imithombo yokukhanya esebenzayo Amasistimu Wokuphepha Nokuphepha: Izinhlelo zokubona ebusuku kwe-infrared zezinhlelo zezimoto, izinzwa zeminwe yokubona, izikena ze-retina. I-Optical Communication & Telecommunication: Kumaswishi e-photonic, i-passive fiber optic components, ama-amplifiers optical, i-mainframe kanye nezinhlelo zokuxhuma zekhompyutha yomuntu siqu. Izakhiwo ezihlakaniphile: Kuzinhlelo zokuzwa ezisekelwe ku-fiber optical nokunye okuningi Izinhlobo zezingxenye ze-micro-optical kanye namasistimu angaphansi esiwakhayo nesiwahlinzekayo yilezi: - I-Wafer Level Optics - I-Refractive Optics - I-Diffractive Optics - Izihlungi - Izigcawu - Ama-Hologram Akhiwe Ngekhompyutha - Izingxenye ze-Hybrid Microoptical - I-Infrared Micro-Optics - I-Polymer Micro-Optics - I-Optical MEMS - I-Monolithically kanye Nezimfihlo Ezididiyelwe I-Micro-Optic Systems Eminye yemikhiqizo yethu esetshenziswa kakhulu yi-micro-optical yile: - I-Bi-convex kanye ne-plano-convex lens - Amalensi e-Achromat - Amalensi ebhola - Amalensi e-Vortex - Amalensi weFresnel - Multifocal Lens - Ama-Cylindrical Lens - Amalensi e-Index (GRIN) Amazinga - Ama-Micro-Optical Prisms - Ama-Aspheres - Ama-Arrays of Aspheres - Ama-Collimators - I-Micro-Lens Arrays - I-Diffraction Gratings - I-Wire-Grid Polarizers - Izihlungi ze-Micro-Optic Digital - I-Pulse Compression Gratings - Amamojula we-LED - Beam Shapers - Isampula ye-Beam - Ring Generator - Micro-Optical Homogenizers / Diffusers - Multispot Beam Splitters - Ama-Dual Wavelength Beam Combiners - I-Micro-Optical Interconnects - Intelligent Micro-Optics Systems - Ukufanekisa ama-Microlense - Micromirrors - Micro Reflectors - I-Micro-Optical Windows - I-Dielectric Mask - Iris diaphragm Ake sikunikeze ulwazi oluyisisekelo mayelana nale mikhiqizo ye-micro-optical kanye nezinhlelo zokusebenza zayo: AMALENSI EBHOLA: Amalensi ebhola amalensi amancane ayindilinga ayindilinga avame ukusetshenziselwa ukuhlanganisa ukukhanya nokuphuma kumafayibha. Sinikezela ngezinhlobonhlobo zamalensi amabhola esitokwe se-micro-optic futhi singawenza ngokwezicaciso zakho. Amalensi amabhola esitoko asuka ku-quartz anokudlulisa okuhle kakhulu kwe-UV kanye ne-IR phakathi kuka-185nm kuya ku->2000nm, futhi amalensi ethu esafire anenkomba ecwebezelayo ephakeme, evumela ubude obufushane kakhulu bokugxila bokuhlangana okuhle kakhulu kwefayibha. Ama-lens amabhola ama-Micro-optical avela kwezinye izinto nama-diameter ayatholakala. Ngaphandle kwezicelo zokuhlanganisa i-fiber, amalensi ebhola e-micro-optical asetshenziswa njengamalensi ahlosiwe ku-endoscopy, izinhlelo zokulinganisa i-laser nokuskena ibhakhodi. Ngakolunye uhlangothi, amalensi e-micro-optic half ball anikezela ngokuhlakazeka okufanayo kokukhanya futhi asetshenziswa kakhulu kuzibonisi ze-LED namarobhothi. I-MICRO-OPTICAL ASPHERES AND ARRAYS: Izindawo ezingaphansi kwe-aspheric zinephrofayili engeyona i-spherical. Ukusetshenziswa kwama-aspheres kunganciphisa inani lama-optical adingekayo ukuze kufinyelelwe ekusebenzeni okufiswayo kokubona. Izinhlelo zokusebenza ezidumile zamalensi ama-micro-optical arrays ane-spherical or aspherical curvature ziwumfanekiso kanye nokukhanya kanye nokungqubuzana okusebenzayo kokukhanya kwe-laser. Ukufakwa esikhundleni kwe-aspheric microlens array yesistimu ye-multilens eyinkimbinkimbi akuphumeleli nje kuphela kusayizi omncane, isisindo esilula, i-compact geometry, nezindleko eziphansi zesistimu yokubona, kodwa futhi nasekuthuthukisweni okuphawulekayo kokusebenza kwayo okubonakalayo njengekhwalithi engcono yokucabanga. Kodwa-ke, ukwakhiwa kwama-aspheric microlens kanye nama-microlens arrays kuyinselele, ngoba ubuchwepheshe obujwayelekile obusetshenziselwa ama-macro-size aspheres njengokugaya idayimane lephuzu elilodwa kanye nokugeleza kabusha kwe-thermal abukwazi ukuchaza iphrofayili eyinkimbinkimbi yelensi ye-micro-optic endaweni encane njengamanye. kumashumi ama-micrometer. Sinolwazi lokukhiqiza izakhiwo ezinjalo ze-micro-optical sisebenzisa amasu athuthukile njengamalaser e-femtosecond. AMALENSI E-MICRO-OPTICAL ACHROMAT: Lawa ma-lens alungele izinhlelo zokusebenza ezidinga ukulungiswa kombala, kuyilapho amalensi e-aspheric aklanyelwe ukulungisa ukuphuma okuyindilinga. Ilensi ye-achromatic noma i-achromat ilensi edizayinelwe ukukhawulela imiphumela ye-chromatic ne-spherical aberration. Amalensi achromatic ama-Micro-optical enza izilungiso ukuze alethe ubude begagasi obubili (njengemibala ebomvu neluhlaza okwesibhakabhaka) ekugxileni endizeni efanayo. AMALENSI angu-CYLINDRICAL: Lawa ma-lens agxila ekukhanyeni emugqeni esikhundleni sephoyinti, njengoba i-lens eyindilinga ingenza. Ubuso obugobile noma ubuso belensi eyisilinda yizigaba zesilinda, futhi zigxilisa isithombe esidlula kuso sibe umugqa ohambisana nokuphambana kobuso belensi kanye nendiza ebheke kuwo. Ilensi eyisilinda icindezela isithombe siye ngakulo mugqa, futhi isishiya singaguquki sibheke ngakuso (endizeni ye-tangent). Izinguqulo ezincane ze-micro-optical ziyatholakala ezilungele ukusetshenziswa ezindaweni ezikhanyayo ezincane, ezidinga izingxenye ze-fiber optical ezinosayizi ohlangene, amasistimu we-laser, namadivayisi abona nge-micro-optical. AMICRO-OPTICAL WINDOWS AND FLATS: Amawindi e-Milimetric micro-optical ahlangabezana nezidingo eziqinile zokubekezelela ayatholakala. Singazikhiqiza ngendlela oyifisayo ngokwezicaciso zakho kusukela kunoma yiziphi izibuko zebanga lokubona. Sinikezela ngezinhlobonhlobo zamafasitela amancane abonakalayo enziwe ngezinto ezihlukene njenge-silica ehlanganisiwe, i-BK7, isafire, i-zinc sulphide….etc. ngokudlulisela kusuka ku-UV kuya kububanzi obuphakathi be-IR. AMAMICROLENSI ABANGABONAKALISAYO: Amalensi amancane amalensi amancane, ngokuvamile anobubanzi obungaphansi kwemilimitha (mm) futhi mancane njengama-micrometres ayi-10. Ama-Imaging Lens asetshenziselwa ukubuka izinto ezinhlelweni zezithombe. Ama-Imaging Lens asetshenziswa ezinhlelweni zokuthwebula izithombe ukuze kugxiliswe isithombe sento ehloliwe kwinzwa yekhamera. Kuye nge-lens, ama-imaging lens angasetshenziswa ukususa i-parallax noma iphutha lokubuka. Bangaphinda banikeze ngokukhuliswa okulungisekayo, inkambu yokubuka, nobude bokugxila. Lawa ma-lens avumela into ukuthi ibukwe ngezindlela ezimbalwa ukukhombisa izici ezithile noma izici ezingafiseleka ezinhlelweni ezithile. I-MICROMIRRORS: Imishini ye-Micromirror isekelwe ezibukweni ezincane ezingabonakali. Izibuko yiMicroelectromechanical systems (MEMS). Izimo zalawa madivaysi e-micro-optical alawulwa ngokufaka i-voltage phakathi kwama-electrode amabili azungeze ama-array wesibuko. Amadivayisi e-micromirror edijithali asetshenziswa kumaprojektha evidiyo futhi okokubona kanye namadivayisi we-micromirror asetshenziselwa ukuchezuka nokulawula ukukhanya. I-MICRO-OPTIC COLLIMATORS NE-COLLIMATOR ARRAYS: Izinhlobonhlobo zama-micro-optical collimator ziyatholakala ngaphandle kweshalofu. Ama-collimator ama-Micro-optical ama-beam amancane ohlelo olufunayo akhiqizwa kusetshenziswa ubuchwepheshe be-laser fusion. Ukuphela kwe-fiber kuhlanganiswe ngokuqondile esikhungweni se-optical se-lens, ngaleyo ndlela kuqedwe i-epoxy ngaphakathi kwendlela yokubona. Indawo yelensi ye-micro-optic collimator bese ipholishwa nge-laser ibe phakathi kwesigidi samayintshi womumo ofanele. Ama-collimator amancane e-Beam akhiqiza imishayo ehlanganisiwe enezingqimba ezingaphansi kwemilimitha. Ama-collimator amancane we-Micro-optical asetshenziswa ku-1064, 1310 noma 1550 nm wavelengths. I-GRIN lens based micro-optic collimator nayo iyatholakala kanye ne-collimator array kanye ne-collimator fiber array assemblies. AMALENSI E-MICRO-OPTICAL FRESNEL: Ilensi yeFresnel iwuhlobo lwamalensi ahlangene aklanyelwe ukuvumela ukwakhiwa kwamalensi omgodi omkhulu nobude bokugxila obufushane ngaphandle kwesisindo nomthamo wezinto ezingadingwa ilensi yomklamo ovamile. Ilensi yeFresnel ingenziwa ibe mncane kakhulu kunelensi evamile eqhathanisekayo, kwesinye isikhathi ithathe isimo seshidi eliyisicaba. Ilensi yeFresnel ingathwebula ukukhanya okutshekile okwengeziwe okuvela emthonjeni wokukhanya, ngaleyo ndlela ivumele ukukhanya ukuthi kubonakale ebangeni elikhulu. Ilensi yeFresnel yehlisa inani lezinto ezidingekayo uma kuqhathaniswa nelensi evamile ngokuhlukanisa ilensi ibe isethi yezigaba ezigxilile zonyaka. Esigabeni ngasinye, ukujiya okuphelele kuyehla uma kuqhathaniswa nelensi elula efanayo. Lokhu kungabukwa njengokuhlukanisa indawo eqhubekayo yelensi evamile ibe isethi yendawo egobile efanayo, nokungaqhubeki okuhamba ngesinyathelo phakathi kwakho. Amalensi e-Micro-optic Fresnel agxila ekukhanyeni ngokuphinda amelane nesethi yendawo egobile egxilile. Lawa ma-lens angenziwa abe mncane kakhulu futhi angasindi. Amalensi e-Micro-optical Fresnel anikezela ngamathuba ku-optics yezinhlelo zokusebenza ze-Xray ezine-resolution, amandla okuxhumana ngewafer optical. Sinezindlela eziningi zokwenza okuhlanganisa i-micromolding kanye ne-micromachining ukuze sikhiqize amalensi ama-Fresnel abonakalayo kanye nezinhlu eziqondene ngqo nezinhlelo zakho zokusebenza. Singaklama ilensi yeFresnel enhle njenge-collimator, iqoqo noma ngama-conjugate amabili anomkhawulo. Amalensi e-Micro-Optical Fresnel avamise ukulungiswa ngenxa yokuphambuka okuyindilinga. Amalensi e-Micro-optic positive angenziwa ngensimbi ukuze asetshenziswe njengesibonisi sendawo yesibili futhi amalensi anegethivu angenziwa ngensimbi ukuze asetshenziswe njengesibonisi sokuqala esingaphezulu. I-MICRO-OPTICAL PRISMS: Ulayini wethu we-micro-optics onembile uhlanganisa ama-prism amancane amboziwe nangamboziwe. Zilungele ukusetshenziswa nemithombo ye-laser nezinhlelo zokusebenza ze-imaging. Amaprism ethu ama-micro-optical anobukhulu be-submilimeter. Amaprism ethu ahlanganiswe ne-micro-optical angasetshenziswa njengezibonisi zesibuko ngokuphathelene nokukhanya okungenayo. Ama-prism angamboziwe asebenza njengezibuko zesigameko esilula kolunye lwezinhlangothi ezifushane njengoba ukukhanya kwesigameko kubonakala ngaphakathi ngokuphelele ku-hypotenuse. Izibonelo zamakhono wethu we-Micro-optical prism zihlanganisa ama-engeli angakwesokudla ama-prism, ama-beamsplitter cube assemblies, ama-Amici prism, ama-K-prism, ama-Dove prism, ama-Roof prism, ama-Cornercube, ama-Pentaprism, ama-Rhomboid prism, ama-Bauernfeind prism, ama-Disperms prism, ama-Disperms prism. Siphinde sinikeze ama-micro-prism akhanyayo aqondisayo kanye nama-de-glaring optical enziwe nge-acrylic, i-polycarbonate nezinye izinto zepulasitiki ngenqubo yokukhiqiza embossing eshisayo yokufakwa kwezibani nezibani, ama-LED. Asebenza kahle kakhulu, anokukhanya okuqinile aqondisa izindawo eziqondile zeprism, izibani ezisekela ukufeza imithetho yehhovisi yokususa ukucwebezela. Izakhiwo ezengeziwe ze-prism ezenziwe ngezifiso zingenzeka. Ama-Microprism kanye ne-microprism arrays ezingeni le-wafer nakho kungenzeka kusetshenziswa amasu okwenziwa nge-microfabrication. I-DIFFRACTION GRATINGS: Sinikeza ukuklama nokwenza izinto ze-diffractive micro-optical element (DOEs). I-diffraction grating iyingxenye ye-optical enesakhiwo sezikhathi ezithile, esihlukanisa futhi sihlukanise ukukhanya kube yimishayo eminingana ehamba ngezindlela ezihlukene. Izikhombisi-ndlela zale misebe zincike esikhaleni sokugawula kanye nobude begagasi bokukhanya ukuze igridi isebenze njengesici esihlakazayo. Lokhu kwenza ukugaya kube into efanelekile ukuthi isetshenziswe kuma-monochromators nama-spectrometer. Sisebenzisa i-wafer-based lithography, sikhiqiza ama-elementi e-micro-optical e-diffractive anezici ezihlukile zokusebenza kwe-thermal, mechanical kanye ne-optical. Ukucutshungulwa kwezinga le-wafer kwe-micro-optics kunikeza ukuphindaphindeka okuhle kakhulu kokukhiqiza kanye nomphumela wezomnotho. Ezinye zezinto ezitholakalayo ze-diffractive micro-optical elements yi-crystal-quartz, fused-silica, glass, silicon kanye nama-synthetic substrates. I-Diffraction gratings iwusizo ezinhlelweni ezifana nokuhlaziywa kwe-spectral / spectroscopy, i-MUX/DEMUX/DWDM, ukulawulwa kokunyakaza okunembayo okufana nakuma-optical encoder. Izindlela ze-Lithography zenza ukwakhiwa kokunemba kwe-micro-optical gratings enezikhala ezilawulwa ngokuqinile ze-groove zenzeke. I-AGS-TECH inikeza kokubili imiklamo yangokwezifiso neyesitoko. AMALENSI E-VORTEX: Kuzinhlelo zokusebenza ze-laser kunesidingo sokuguqula i-Gaussian beam ibe indandatho yamandla emise okwe-donut. Lokhu kufinyelelwa kusetshenziswa amalensi e-Vortex. Ezinye izinhlelo zokusebenza ziku-lithography kanye ne-high-resolution microscopy. Amapuleti esigaba se-Polymer engilazini i-Vortex nawo ayatholakala. I-MICRO-OPTICAL HOMOGENIZERS / DIFFUSERS: Kusetshenziswa ubuchwepheshe obuhlukahlukene ukwenza ama-homogenizer nama-diffuser wethu we-micro-optical, okuhlanganisa i-embossing, amafilimu e-diffuser akhiwe, ama-diffuser afakiwe, izihlukanisi ze-HiLAM. I-Laser Speckle isenzakalo esibonakalayo esibangelwa ukuphazamiseka okungahleliwe kokukhanya okuhlangene. Lesi senzo sisetshenziselwa ukukala Umsebenzi Wokudluliswa Kwemodyuli (MTF) weqoqo lomtshina. Ama-Microlens diffuser aboniswa njengamadivayisi asebenza kahle e-micro-optic okukhiqiza amachashaza. AMA-BEAM SHAPERS: I-micro-optic beam shaper iyi-optic noma isethi ye-optics eguqula kokubili ukusabalalisa kokuqina kanye nokuma kwendawo kwe-laser beam kube into efiseleka kakhulu ohlelweni olunikeziwe. Imvamisa, i-laser efana ne-Gaussian noma engafanani ne-laser iguqulwa ibe yi-flat top top. I-Beam shaper micro-optics isetshenziselwa ukubumba nokukhohlisa imodi eyodwa kanye nemishayo ye-laser enemodi eminingi. I-beam shaper micro-optics yethu ihlinzeka ngomumo oyindilinga, oyisikwele, we-rectilinear, oyi-hexagonal noma womugqa, futhi yenza i-homogenize ugongolo (ingaphezulu eliyisicaba) noma inikeze iphethini yokuqina yangokwezifiso ngokuya ngezidingo zohlelo lokusebenza. Ama-elementi e-refractive, diffractive kanye ne-refletive micro-optical ye-laser beam shape kanye ne-homogenizing seyenziwe. Izinto ezisebenza kaningi ze-micro-optical zisetshenziselwa ukubumba amaphrofayili e-laser beam ehlukahlukene abe amajiyometri ahlukahlukene afana, i-homogeneous spot array noma iphethini yomugqa, ishidi lokukhanya le-laser noma amaphrofayili okuqina okuphezulu phezulu. Izibonelo ezinhle zesicelo se-beam ukusika kanye nokushisela kwe-keyhole. Izibonelo zokusetshenziswa kwe-broad beam i-conduction welding, i-brazing, i-soldering, ukwelashwa kokushisa, ukukhipha ifilimu elincanyana, ukuchama nge-laser. I-PULSE COMPRESSITION GRATINGS: Pulse compression iyindlela ewusizo esebenzisa ubudlelwano phakathi kobude be-pulse kanye nobubanzi be-spectral bokushaya kwenhliziyo. Lokhu kuvumela ukukhuliswa kwama-laser pulses ngaphezu kwemikhawulo evamile yomonakalo ebekwe yizingxenye zokubona ohlelweni lwe-laser. Kunezindlela eziqondile nezingaqondile zokunciphisa ubude be-optical pulses. Kunezindlela ezihlukahlukene zokucindezela okwesikhashana / ukufinyeza ama-optical pulses, okungukuthi, ukunciphisa ubude be-pulse. Lezi zindlela ngokuvamile ziqala esifundeni se-picosecond noma i-femtosecond, okungukuthi kakade kuhulumeni wama-ultrashort pulses. I-MULTISPOT BEAM SPLITTERS: Ukuhlukaniswa kwe-beam kusetshenziswa izakhi ezihlukanisiwe kuyafiseleka uma i-elementi eyodwa idingeka ukuze kukhiqizwe imishayo eminingana noma uma kudingeka ukuhlukaniswa kwamandla okukhanya okunembile impela. Ukuma okunembayo nakho kungafinyelelwa, isibonelo, ukwakha izimbobo emabangeni achazwe ngokucacile nanembile. Sine-Multi-Spot Elements, i-Beam Sampler Element, i-Multi-Focus Element. Ngokusebenzisa isici esihlukanisayo, imishayo yesigameko ehlanganisiwe ihlukaniswa ibe imishayo eminingana. Le mishayo ye-optical inokuqina okulinganayo kanye ne-engeli elinganayo kwenye. Sinazo zombili izici ezinohlangothi olulodwa kanye nezinhlangothi ezimbili. Izakhi ze-1D zihlukanisa imishayo ngomugqa oqondile kuyilapho ama-elementi e-2D akhiqiza imishayo ehlelwe nge-matrix, isibonelo, amachashazi angu-2 x 2 noma angu-3 x 3 nezici ezinamachashaza ahlelwe ngama-hexagonal. Izinguqulo ze-Micro-optical ziyatholakala. IZINTO ZE-BEAM SAMPLER: Lawa ma-elementi ama-grating asetshenziselwa ukuqapha okusemgqeni kwama-laser amandla aphezulu. I-oda yokuqala ye-diffraction ingasetshenziselwa izilinganiso ze-beam. Ubukhulu bawo buphansi kakhulu kunalolo lwe-beam eyinhloko futhi lungaklanywa ngokwezifiso. Ama-diffraction ama-oda aphezulu angaphinda asetshenziselwe ukulinganisa ngamandla aphansi. Ukwehluka kokuqina kanye nezinguquko kuphrofayela ye-beam yama-laser anamandla aphezulu kungagadwa ngokuthembekile emgqeni kusetshenziswa le ndlela. IZIMPAWU ZOKUGXILA KANINGI: Ngale elementi ehlukanisayo amaphoyinti okugxila ambalwa angadalwa eduze kwe-eksisi yokubona. Lezi zakhi ezibonakalayo zisetshenziselwa izinzwa, i-ophthalmology, ukucubungula impahla. Izinguqulo ze-Micro-optical ziyatholakala. IZIXHUMANO ZAMA-MICRO-OPTICAL: Izixhumi ezibonakalayo bezilokhu zishintsha izintambo zikagesi zethusi emazingeni ahlukene kuhlelo lwe-interconnect hierarchy. Enye yamathuba okuletha izinzuzo zokuxhumana nge-micro-optics ku-backplane yekhompiyutha, ibhodi lesekethe eliphrintiwe, izinga le-inter-chip kanye ne-on-chip interconnect level, ukusebenzisa amamojula wokuxhumanisa ama-micro-optical interconnect enziwe ngepulasitiki. Lawa mamojula ayakwazi ukuthwala umkhawulokudonsa wokuxhumana ophezulu ohlanganisa izinkulungwane zezixhumanisi ezibonakalayo zephoyinti ukuya ephuzwini endaweni yesentimitha yesikwele. Xhumana nathi ukuze uthole i-off-shelf kanye nokuxhumanisa okuklanywe ngokwezifiso kwe-micro-optical kwendiza yangemuva yekhompyutha, ibhodi lesekethe eliphrintiwe, amazinga e-inter-chip kanye ne-on-chip interconnect. IZIHLELO ZE-MICRO-OPTICS EZIHLAKANIPHILE: Amamojula ahlakaniphile okukhanya kwe-micro-optic asetshenziswa kumafoni ahlakaniphile nakumadivaysi ahlakaniphile ezinhlelo zokusebenza ze-flash ye-LED, ekuxhumaneni optical ukuthutha idatha ngamakhompiyutha amakhulu kanye nemishini yezokuxhumana, njengezixazululo ezincane zokubunjwa kwe-infrared eduze kwe-infrared, ukutholwa emdlalweni. izinhlelo zokusebenza kanye nokweseka ukulawula ukuthinta ekusebenzelaneni komsebenzisi okungokwemvelo. Amamojula wokuzwa we-opto-electronic asetshenziselwa inani lezinhlelo zokusebenza zomkhiqizo ezifana nezinzwa ze-ambient nezinzwa eziseduze kumafoni ahlakaniphile. Amasistimu e-imaging micro-optic ahlakaniphile asetshenziselwa amakhamera ayisisekelo nangaphambili. Sinikeza futhi amasistimu enziwe ngezifiso ama-micro-optical asebenza ngendlela ephezulu kanye nokwenza kube lula. AMAMODULE E-LED: Ungathola ama-chips e-LED, ama-dies and modules ekhasini lethu Ukukhiqiza Izingxenye Zokukhanyisa Nokukhanyisa ngokuchofoza lapha. AMA-POLARIZER WE-WIRE-GRID: Lezi zihlanganisa izintambo ezivamile zensimbi ezicolekileyo ezihambisanayo, ezibekwe endizeni eqondana nomugqa wesigameko. I-polarization direction is perpendicular to the wires. Ama-polarizer anephethini anezinhlelo zokusebenza ku-polarimetry, i-interferometry, izibonisi ze-3D, nokugcinwa kwedatha yokubona. Ama-polarizer wegridi yocingo asetshenziswa kakhulu ezinhlelweni ze-infrared. Ngakolunye uhlangothi ama-polarizers ane-micropatterned wire-grid anokulungiswa kwendawo okulinganiselwe kanye nokusebenza kabi kumaza wamaza abonakalayo, angenwa kalula amaphutha futhi awakwazi ukunwetshwa kalula kuma-polarizations angewona umugqa. Ama-polarizer anamaphikiseli asebenzisa amagridi e-nanowire anephethini emincane. Ama-polarizers ama-pixelated micro-optical angaqondaniswa namakhamera, izindiza zezindiza, ama-interferometers, nama-microbolometers ngaphandle kwesidingo sokushintshwa kwemishini ye-polarizer. Izithombe ezigqamile ezihlukanisa phakathi kwama-polarizations amaningi kuwo wonke amaza amaza abonakalayo kanye ne-IR zingathwetshulwa kanyekanye ngesikhathi sangempela esivumela izithombe ezisheshayo, ezinokucaca okuphezulu. I-Pixelated micro-optical polarizers iphinda inike amandla izithombe ezicacile ze-2D ne-3D ngisho nasezimeni zokukhanya okuphansi. Sinikeza ama-polarizer anephethini emishini yokuthwebula yezifunda ezimbili, ezintathu nezine. Izinguqulo ze-Micro-optical ziyatholakala. AMALENSI ESIQINISEKISO (I-GRIN): Ukuhluka kancane kancane kwenkomba ye-refractive (n) yento engasetshenziswa ukuze kukhiqizwe amalensi anezindawo eziyisicaba, noma amalensi angenakho ukuphambana okuvamise ukubonwa ngamalensi ayisiyingi endabuko. Amalensi e-Gradient-index (GRIN) angase abe ne-refraction gradient eyi-spherical, axial, noma radial. Izinguqulo ezincane kakhulu ze-micro-optical ziyatholakala. IZIHLUNGI EZIZIHLUNGI EZIYI-MICRO-OPTIC DIGITAL: Izihlungi zeDigital neutral density zisetshenziselwa ukulawula amaphrofayili wokuqina wezinhlelo zokukhanyisa kanye ne-projection. Lezi zihlungi ze-micro-optic ziqukethe izakhi ezincane zokumunca insimbi ezisatshalaliswa ngokungahleliwe ku-substrate ye-silica ehlanganisiwe. Izici zalezi zingxenye ze-Micro-optical ukunemba okuphezulu, indawo enkulu ecacile, umkhawulo womonakalo omkhulu, ukuncishiswa kwe-broadband ye-DUV ukuya kumaza wamaza we-IR, achazwe kahle iphrofayili yokudlulisela enohlangothi olulodwa noma amabili. Ezinye izinhlelo zokusebenza ziyizimbobo zonqenqema ezithambile, ukulungiswa okunembile kwamaphrofayili wokuqina ezinhlelweni zokukhanyisa noma zokuqagela, izihlungi eziguquguqukayo zokuthibaza zamalambu anamandla amakhulu kanye nemishayo ye-laser eyandisiwe. Singakwazi ukwenza ngokwezifiso ukuminyana nobukhulu bezakhiwo ukuze kuhlangatshezwane ngokuqondile namaphrofayili okudlulisela adingwa uhlelo lokusebenza. I-MULTI-WAVELENGTH BEAM COMBINERS: Izihlanganisi ze-Multi-Wavelength beam zihlanganisa ama-collimator amabili e-LED anobude obuhlukahlukene be-wavelengths ibe i-beam eyodwa ehlanganisiwe. Izihlanganisi eziningi zingancishiswa ukuze kuhlanganiswe imithombo ye-collimator ye-LED engaphezu kwemibili. Izihlanganisi ze-beam zenziwe ngezihlukanisi ze-dichroic ze-dichroic eziphezulu ezihlanganisa ubude be-wavelength kanye> nokusebenza kahle kwe-95%. Izinguqulo ezincane kakhulu ze-micro-optic ziyatholakala. CLICK Product Finder-Locator Service IKHASI ELIDLULE

Surface Treatment and Modification - Surface Engineering - Hardening - Plasma - Laser - Ion Implantation - Electron Beam Processing at AGS-TECH Ukwelapha Okuphezulu Nokuguqulwa Imibuso imboza yonke into. Ukukhanga kanye nokusebenza okubonakalayo okusihlinzekayo kubaluleke kakhulu. Therefore SURFACE TREATMENT and SURFACE MODIFICATION are among our everyday industrial operations. Ukwelashwa nokulungiswa kwendawo kuholela ekuthuthukisweni kwezakhiwo ezingaphezulu futhi kungenziwa njengokuqeda umsebenzi wokugcina noma ngaphambi kokumboza noma ukuhlanganisa ukusebenza. , lungisa ubuso bezinto nemikhiqizo ukuze: - Lawula ukungqubuzana nokuguga - Thuthukisa ukumelana nokugqwala - Thuthukisa ukunamathela kwezingubo ezilandelayo noma izingxenye ezihlanganisiwe - Shintsha i-conductivity yezakhiwo zomzimba, ukumelana nokuqina, amandla angaphezulu kanye nokuzindla - Shintsha izakhiwo zamakhemikhali zezindawo ngokwethula amaqembu asebenzayo - Shintsha ubukhulu - Shintsha indlela obukeka ngayo, isib, umbala, ukuhwalala... njll. - Hlanza futhi / noma bulala amagciwane endaweni Ngokusetshenziswa kokwelashwa okungaphezulu nokuguqulwa, imisebenzi kanye nezimpilo zesevisi yezinto zokwakha zingathuthukiswa. Izindlela zethu zokwelashwa ezivamile nezindlela zokuguqula zingahlukaniswa zibe izigaba ezimbili ezinkulu: Ukwelashwa Nokulungiswa Kwendawo Engaphansi: I-Organic Coatings: Izingubo zemvelo zisebenzisa upende, usimende, amalaminates, izimpushana ezihlanganisiwe kanye nezinto zokugcoba endaweni yezinto. I-Inorganic Coatings: Izigqoko zethu ezithandwayo ze-inorganic ziwukuba yi-electroplating, i-autocatalytic plating (i-electroless plating), okokuguqula, izifutho ezishisayo, ukucwiliswa okushisayo, ukufaka okuqinile, ukuhlanganisa isithando somlilo, okokuhlanganisa ifilimu emincane efana ne-SiO2, i-SiN kunsimbi, ingilazi, izitsha zobumba,….etc. Ngiyacela, ukwelashwa nokulungiswa kwendawo engaphezulu okuhlanganisa ama-coatings kuchazwe ngokuningiliziwe ngaphansi kwemenyu encane ehlobenechofoza lapha Izingubo Ezisebenzayo / Izingubo Zokuhlobisa / Ifilimu Encane / Ifilimu Eminyene Ukwelashwa Okuphezulu Nokulungiswa Okushintsha Indawo: Lapha kuleli khasi sizogxila kulokhu. Akuwona wonke amasu okwelapha okungaphezulu kanye nokuguqula esiwachaza ngezansi asezingeni elincane noma le-nano-scale, kodwa nokho sizosho ngawo kafushane njengoba izinhloso nezindlela eziyisisekelo zifana nezinga elibalulekile kulezo ezisesikalini sokukhiqiza okuncane. Ukuqina: Ukuqina kwendawo ekhethiwe nge-laser, ilangabi, induction kanye ne-electron beam. Ukwelapha Amandla Aphezulu: Ezinye zezindlela zokwelapha zethu ezinamandla aphezulu zihlanganisa ukufakwa kwe-ion, i-laser glazing & fusion, nokwelashwa kwe-electron beam. Ukwelashwa Kokusabalalisa Okuncane: Izinqubo zokusabalalisa ezincane zifaka i-ferritic-nitrocarburizing, i-boronizing, ezinye izinqubo zokusabela kwezinga lokushisa eliphezulu njenge-TiC, VC. Ukwelashwa Kokusabalalisa Okusindayo: Izinqubo zethu zokusabalalisa ezinzima zifaka i-carburizing, i-nitriding, ne-carbonitriding. Ukwelashwa Okukhethekile Kwendawo: Ukwelashwa okukhethekile okufana nokwelashwa kwe-cryogenic, kazibuthe, kanye ne-sonic kuthinta kokubili indawo engaphezulu nezinto eziningi. Izinqubo zokuqina ezikhethiwe zingenziwa ngelangabi, induction, i-electron beam, i-laser beam. Ama-substrates amakhulu aqiniswa ngokujulile kusetshenziswa ukuqina komlilo. Ukuqina kwe-induction ngakolunye uhlangothi kusetshenziselwa izingxenye ezincane. Ukuqina kwe-laser kanye ne-electron beam ngezinye izikhathi akuhlukanisiwe kulezo ezifakwe ku-hardfacing noma ukwelashwa okunamandla amakhulu. Lezi zinqubo zokwelashwa nokulungiswa kwendawo zisebenza kuphela ezinsimbi ezinekhabhoni eyanele nengxube yengxubevange ukuvumela ukuqina. Ama-cast irons, izinsimbi ze-carbon, izinsimbi zamathuluzi, nezinsimbi ze-alloy zifanele lokhu kwelashwa kwendawo kanye nendlela yokulungisa. Ubukhulu bezingxenye abushintshiwe kakhulu yilokhu kwelashwa kwendawo eqinile. Ukujula kokuqina kungahluka ukusuka kuma-microns angu-250 kuye kububanzi besigaba sonke. Kodwa-ke, kulo lonke icala lesigaba, isigaba kufanele sibe mncane, sibe ngaphansi kuka-25 mm (1 in), noma sincane, ngoba izinqubo zokuqina zidinga ukupholisa okusheshayo kwezinto, ngezinye izikhathi ngaphakathi komzuzwana. Lokhu kunzima ukufeza kuma-workpieces amakhulu, ngakho-ke ezingxenyeni ezinkulu, izindawo ezingaphezulu kuphela ezingaqiniswa. Njengendlela yokwelapha yendawo edumile kanye nenqubo yokulungisa siqinisa iziphethu, izinsimbi zommese, nezinsimbi zokuhlinza phakathi kweminye imikhiqizo eminingi. Izinqubo zamandla aphezulu ziyindlela entsha yokwelashwa kwendawo kanye nezindlela zokuyilungisa. Izakhiwo zezindawo ezingaphezulu ziyashintshwa ngaphandle kokushintsha ubukhulu. Izinqubo zethu ezidumile zokwelapha indawo yamandla aphezulu ziwukwelashwa kwe-electron beam, ukufakwa kwe-ion, nokwelashwa kwe-laser beam. Ukwelashwa kwe-Electron Beam: Ukwelashwa kwe-electronic beam surface kushintsha izakhiwo ezingaphezulu ngokushisisa ngokushesha nokupholisa ngokushesha — ngokulandelana kwe-10Exp6 Centigrade/sec (10exp6 Fahrenheit/sec) endaweni engashoni kakhulu ezizungeze ama-microns angu-100 eduze nendawo ebonakalayo. Ukwelashwa kwe-electron beam nakho kungasetshenziswa ku-hardfacing ukukhiqiza ama-alloys angaphezulu. Ukufakwa kwe-Ion: Lokhu kwelashwa okungaphezulu kanye nendlela yokuguqula kusebenzisa i-electron beam noma i-plasma ukuguqula ama-athomu egesi abe ama-ion anamandla anele, futhi ifake/ifake ama-ion ku-athomu ye-athomu ye-substrate, esheshiswa amakhoyili kazibuthe egumbini le-vacuum. I-vacuum yenza kube lula ukuthi ama-ion ahambe ngokukhululeka ekamelweni. Ukungafani phakathi kwama-ion afakiwe kanye nengaphezulu lensimbi kudala ukukhubazeka kwe-athomu eyenza indawo engaphezulu ibe lukhuni. Ukwelashwa Kwe-Laser Beam: Njengokwelashwa kwe-electron beam surface kanye nokuguqulwa, ukwelashwa kwe-laser beam kushintsha izakhiwo ezingaphezulu ngokufudumeza ngokushesha nokupholisa ngokushesha endaweni engashoni kakhulu eduze kwendawo. Le ndlela yokwelapha nokuguqula ingaphezulu ingasetshenziswa futhi ku-hardfacing ukukhiqiza ama-alloys angaphezulu. Ulwazi Lwemithamo Yokufakelwa kanye nemingcele yokwelapha kwenza kube nokwenzeka ngathi ukuthi sisebenzise lezi zindlela zokwelapha ezingaphezulu kwamandla ezitshalweni zethu zokukhiqiza. Ukwelashwa Kwendawo Yokuhlukanisa Okuncane: I-Ferritic nitrocarburizing iyinqubo yokuqinisa ikesi esakaza i-nitrogen nekhabhoni zibe izinsimbi ezisansimbi emazingeni okushisa angebucayi kakhulu. Izinga lokushisa lokucubungula livamise ukuba ku-565 Centigrade (1049 Fahrenheit). Kulokhu izinga lokushisa ama-steels kanye namanye ama-alloys ayoni asesesigabeni se-ferritic, okuyinzuzo uma kuqhathaniswa nezinye izinqubo zokuqina kwecala ezenzeka esigabeni se-austenitic. Inqubo isetshenziselwa ukuthuthukisa: •ukumelana ne-scuffing •izimpawu zokukhathala •ukumelana nokugqwala Ukuhlanekezela okuncane kakhulu komumo kwenzeka ngesikhathi senqubo yokuqina ngenxa yamazinga okushisa aphansi okucubungula. I-Boronizing, inqubo lapho i-boron yethulwa khona ensimbi noma i-alloy. Kuwukuqina kobuso kanye nenqubo yokuguqulwa lapho ama-athomu e-boron asakazwa khona ebusweni bengxenye yensimbi. Ngenxa yalokho ingaphezulu liqukethe i-borides yensimbi, njenge-iron borides kanye ne-nickel borides. Esimeni sawo esimsulwa lawa ma-boride anobunzima obuphezulu kakhulu nokumelana nokugqoka. Izingxenye zensimbi eziboshiwe zimelana kakhulu nokuguga futhi ngokuvamile zizohlala isikhathi esiphindwe kahlanu kunezingxenye eziphathwa ngokwelashwa okujwayelekile kokushisa okufana nokwenza lukhuni, carburizing, nitriding, nitrocarburizing noma induction hardening. Ukwelashwa Nokulungiswa Kwendawo Enzima Yokuhlukanisa: Uma okuqukethwe kwekhabhoni kuphansi (ngokwesibonelo, ngaphansi kuka-0.25%) singase sikhulise okuqukethwe kwekhabhoni kwendawo ukuze kuqiniswe. Ingxenye ingaphathwa ngokushisa ngokucisha oketshezini noma ipholiswe emoyeni onganyakazi kuye ngezakhiwo ezifunwayo. Le ndlela izovumela kuphela ukuqina kwendawo ebusweni, kodwa hhayi phakathi. Lokhu ngezinye izikhathi kufiseleka kakhulu ngoba kuvumela indawo eqinile enezakhiwo ezinhle zokugqokwa njengakumagiya, kodwa inomongo oqinile wangaphakathi ozokwenza kahle ngaphansi kokulayishwa komthelela. Kwenye yezindlela zokwelapha ezingaphezulu nezindlela zokuguqula, okuyiCarburizing sifaka ikhabhoni phezulu. Sidalula ingxenye emkhathini ocebile weCarbon ezingeni lokushisa eliphezulu futhi sivumele ukusakazeka kudlulisele ama-athomu eKhabhoni ensimbi. Ukusabalalisa kuzokwenzeka kuphela uma insimbi inokuqukethwe kwekhabhoni ephansi, ngoba ukusabalalisa kusebenza kumehluko wesimiso sokugxila. I-Pack Carburizing: Izingxenye zipakishwa endaweni ephakeme ye-carbon medium efana ne-carbon powder futhi zishiswe esithandweni amahora angu-12 kuya kwangu-72 ku-900 Centigrade (1652 Fahrenheit). Kulawa mazinga okushisa kukhiqizwa i-CO gas okuyi-ejenti yokunciphisa enamandla. Ukusabela kokunciphisa kwenzeka ebusweni bensimbi ekhulula ikhabhoni. Ikhabhoni ibe isisakazwa ebusweni ngenxa yokushisa okuphezulu. Ikhabhoni engaphezulu ingu-0.7% kuya ku-1.2% kuye ngezimo zenqubo. Ukuqina okuzuziwe kungu-60 - 65 RC. Ukujula kwekesi le-carburized kusuka cishe ku-0.1 mm kuya ku-1.5 mm. Ukupakisha i-carburizing kudinga ukulawula okuhle kokufana kwezinga lokushisa kanye nokungaguquguquki ekushiseni. I-Gas Carburizing: Kulokhu okuhlukile kokwelashwa okungaphezulu, igesi ye-Carbon Monoxide (CO) inikezwa esithandweni esishisayo futhi ukusabela kokunciphisa ukufakwa kwekhabhoni kwenzeka phezu kwezingxenye. Le nqubo inqoba iningi lezinkinga ze-pack carburizing. Okunye okukhathazayo nokho ukutholakala okuphephile kwegesi ye-CO. I-Liquid Carburizing: Izingxenye zensimbi zicwiliswa kubhavu ocebile ngekhabhoni encibilikisiwe. I-Nitriding iwukwelashwa okungaphezulu kanye nenqubo yokuguqula ehilela ukusakazeka kweNitrojeni ebusweni bensimbi. I-nitrogen yakha ama-Nitrides anezici ezifana ne-Aluminium, i-Chromium, ne-Molybdenum. Izingxenye ziphathwa ngokushisa futhi zishiswe ngaphambi kwe-nitriding. Izingxenye zibe sezihlanzwa futhi zishiselwe esithandweni endaweni ye-ammonia ehlukanisiwe (equkethe u-N no-H) amahora angu-10 kuya kwangu-40 ku-500-625 Centigrade (932 - 1157 Fahrenheit). I-nitrogen isakazeka ensimbi futhi yakhe ama-nitride alloys. Lokhu kungena ekujuleni okungafika ku-0.65 mm. Icala linzima kakhulu futhi ukuhlanekezela kuphansi. Njengoba ikesi lincane, ukugaywa okungaphezulu akunconyiwe ngakho-ke ukwelashwa kwe-nitriding surface kungase kungabi inketho yezindawo ezinezidingo zokuqeda ezibushelelezi. Ukwelashwa kwe-Carbonitriding surface kanye nenqubo yokuguqulwa kulungele kakhulu izinsimbi eziphansi ze-carbon alloy. Enqubweni ye-carbonitriding, kokubili i-Carbon ne-Nitrogen zisakazwa phezulu. Izingxenye zishiselwa emkhathini we-hydrocarbon (njenge-methane noma i-propane) exutshwe ne-Ammonia (NH3). Kalula nje, inqubo iyingxube ye-Carburizing ne-Nitriding. Ukwelashwa kwe-Carbonitriding surface kwenziwa emazingeni okushisa angama-760 - 870 Centigrade (1400 - 1598 Fahrenheit), Bese kucinywa emoyeni wegesi yemvelo (i-Oxygen free). Inqubo ye-carbonitriding ayifanele izingxenye ezinemba okuphezulu ngenxa yokuhlanekezela okungokwemvelo. Ubulukhuni obuzuziwe bufana nokungcwaba (60 - 65 RC) kodwa hhayi phezulu njenge-Nitriding (70 RC). Ukujula kwekesi kuphakathi kuka-0.1 no-0.75 mm. Icala licebile ku-Nitrides kanye ne-Martensite. Ukuthukuthela okulandelayo kuyadingeka ukuze kuncishiswe ama-brittleness. Ukwelashwa okukhethekile kwendawo kanye nezinqubo zokuguqulwa kusezigabeni zokuqala zokukhula futhi ukusebenza kahle kwazo akukakafakazelwa. Kunjalo: I-Cryogenic Treatment: Ngokuvamile isetshenziswa ezinsimbini eziqinile, zipholisa kancane kancane i-substrate ibe cishe -166 Centigrade (-300 Fahrenheit) ukuze kwandiswe ukuminyana kwezinto futhi ngaleyo ndlela kwandise ukumelana nokuguga nokuzinza kobukhulu. Ukwelashwa Ngokudlidliza: Lokhu kuhloswe ukukhulula ingcindezi yokushisa eyakhelwe ekwelapheni ukushisa ngokudlidliza futhi kwandise impilo yokuguga. Ukwelashwa Ngozibuthe: Lokhu kuhloswe ukushintsha ukuhleleka kwama-athomu ezintweni ngozibuthe futhi ngethemba ukuthi kuthuthukise impilo yokuguga. Ukusebenza kwalokhu kwelashwa okukhethekile kwendawo kanye namasu okuguqula kusazofakazelwa. Futhi lezi zindlela ezintathu ezingenhla zithinta impahla eyinqwaba ngaphandle kwezindawo. CLICK Product Finder-Locator Service IKHASI ELIDLULE